Loading...

MTFC8GLDEA-4MIT

Micron Technology

MTFC8GLDEA-4MIT by Micron Technology

MTFC8GLDEA-4MIT by Micron Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V. The package style is GRID ARRAY, very thin profile, fine pitch, making it suitable for industrial applications requiring high performance in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 11,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,900

-

-

-

-

Vyrian

USA . 7,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,260

-

-

-

-

Dynamic Solutions

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Digiode

USA . 1,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,411

-

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Cyclops Electronics Ltd

UK . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$14.910

100+ parts

-

1k+ parts

-

10k+ parts

-

202

$14.910

-

-

-

Corohmni

South Africa . 2,532 parts In-Stock

1+ parts

$18.796

100+ parts

-

1k+ parts

-

10k+ parts

-

2,532

$18.796

-

-

-

Aztec Data Supply Inc.

USA . 2,361 parts In-Stock

1+ parts

$20.760

100+ parts

-

1k+ parts

-

10k+ parts

-

2,361

$20.760

-

-

-

Semicontronic

India . 1,191 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

10k+ parts

-

1,191

$27.000

$26.325

$26.190

-

Ampacity Inc.

Singapore . 362 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

-

362

$29.000

-

-

-

A-Z Elektronik GmbH

Germany . 7,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,212

-

-

-

-

Argo Parts USA

USA . 4,427 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,427

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Continental Prestige Electronics

USA . 2,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,479

-

-

-

-

Corphita

USA . 2,040 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,040

-

-

-

-

Kepictronics

USA . 1,356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,356

-

-

-

-

Perfect Parts

USA . 1,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,163

-

-

-

-

RC Electronics

USA . 586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

586

-

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Microchip USA

USA . 280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

280

-

-

-

-

Futuretech Components

Singapore . 105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

105

-

-

-

-

Overview

Experience unparalleled performance and reliability with the MTFC8GLDEA-4MIT by Micron Technology. As a trusted leader in the industry, Micron Technology offers cutting-edge solutions for a wide range of applications in the category of Other Function uPs, uCs & Peripheral ICs. This product boasts top-quality construction with a package body material of PLASTIC/EPOXY and a surface mount design. With a maximum supply voltage of 1.95V and a minimum operating temperature of -40 °C, customers can trust in the durability and efficiency of this product. Elevate your projects with the unmatched value and benefits that Micron Technology provides through the MTFC8GLDEA-4MIT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the components inside, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.95 V

Supports a higher voltage input range, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Facilitates easy placement and orientation on the circuit board, aiding in the manufacturing process.

No. of Terminals: 153

Offering a large number of connection points, allowing for complex circuit designs and increased functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high-density mounting and precise connections, enhancing overall performance and reliability.

Minimum Supply Voltage: 1.65 V

Ensures operation at lower power levels, helping to reduce energy consumption and heat generation.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with demanding temperature environments, ensuring reliability under harsh conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely cold conditions, expanding the range of potential use cases.

Terminal Finish: TIN SILVER COPPER

Offers corrosion resistance and good conductivity for stable electrical connections.

Terminal Position: BOTTOM

Facilitates easy and secure PCB mounting, enhancing the overall stability of the device.

Maximum Seated Height: 0.8 mm

Slim profile allows for compact design and efficient use of space in electronic devices.

Width: 11.5 mm

Compact size enables integration in small electronic devices without sacrificing performance.

Length: 13 mm

Optimal dimensions for fitting into various electronic applications, providing versatility in design.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability in challenging conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates advanced processing capabilities, enabling complex functions and high-performance computing tasks.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, enhancing efficiency and performance.

Terminal Form: BALL

Provides secure and reliable connections, reducing the risk of disconnection or signal loss.

Nominal Supply Voltage: 1.8 V

Standard voltage level for compatibility with various power sources, ensuring seamless integration.

Terminal Pitch: 0.5 mm

Fine pitch allows for precise and compact layout on the PCB, optimizing circuit density and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MTFC8GLDEA-4MIT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Micron Technology

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 VOLTS

JESD-30 Code:

R-PBGA-B153

JESD-609 Code:

e1

Length:

13 mm

No. of Terminals:

153

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11.5 mm

Peripheral IC Type:

Trade Compliance

MTFC8GLDEA-4MIT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19