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MIMX8MM6DVTLZAA

NXP Semiconductors

MIMX8MM6DVTLZAA by NXP Semiconductors

MIMX8MM6DVTLZAA by NXP Semiconductors is a low-profile, fine-pitch SoC with 486 terminals. It operates at a voltage range of 0.95V to 1.05V and can withstand temperatures up to 95°C. This versatile chip is commonly used in various applications requiring high-performance microcontrollers and peripheral ICs.

Median Price

$32.035

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 440 parts In-Stock

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$22.400

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$20.800

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440

$22.400

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Arrow

USA . 93 parts In-Stock

1+ parts

$31.740

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$22.700

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$21.270

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93

$31.740

$22.700

$21.270

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Newark

USA . 152 parts In-Stock

1+ parts

$32.330

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$22.970

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$22.400

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152

$32.330

$22.970

$22.400

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DigiKey

USA . 376 parts In-Stock

1+ parts

$32.660

100+ parts

$24.871

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$22.197

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376

$32.660

$24.871

$22.197

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Farnell

UK . 442 parts In-Stock

1+ parts

$33.930

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$23.240

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442

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$23.240

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Element14

Singapore . 442 parts In-Stock

1+ parts

$3,529.790

100+ parts

$2,419.890

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442

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$2,419.890

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Flip Electronics (Authorized)

USA . 1,672 parts In-Stock

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Verical

USA . 608 parts In-Stock

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$23.875

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$21.363

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$20.100

608

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$23.875

$21.363

$20.100

Rochester

USA . 608 parts In-Stock

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$19.100

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$17.090

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$16.080

608

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$16.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,260 parts In-Stock

1+ parts

$20.159

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4,260

$20.159

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IBS Electronics

USA . 117 parts In-Stock

1+ parts

$23.764

100+ parts

$22.984

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$22.633

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117

$23.764

$22.984

$22.633

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Nova Conductors

Japan . 100 parts In-Stock

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$31.024

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100

$31.024

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TME

Poland . 143 parts In-Stock

1+ parts

$43.280

100+ parts

$32.490

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143

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$32.490

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Component Sense

UK . 7,910 parts In-Stock

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Chip Stock

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Anansix

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Vyrian

USA . 1,618 parts In-Stock

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NAC Semi

USA . 304 parts In-Stock

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$23.970

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Flip Electronics

USA . 152 parts In-Stock

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ComSIT Distribution GmbH

Germany . 54 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,011 parts In-Stock

1+ parts

$18.040

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2,011

$18.040

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Semicontronic

India . 1,798 parts In-Stock

1+ parts

$18.040

100+ parts

$17.589

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$17.499

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1,798

$18.040

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$17.499

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Corphita

USA . 310 parts In-Stock

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$19.098

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$19.098

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Netroflash

USA . 50 parts In-Stock

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$31.024

100+ parts

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$29.473

10k+ parts

$28.852

50

$31.024

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$29.473

$28.852

Component Stockers USA

USA . 108 parts In-Stock

1+ parts

$32.230

100+ parts

$25.130

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108

$32.230

$25.130

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Modulus Dynamics

Lithuania . 2,494 parts In-Stock

1+ parts

$33.483

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$33.483

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$33.483

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2,494

$33.483

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Corohmni

South Africa . 218 parts In-Stock

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$34.013

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$34.013

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Continental Prestige Electronics

USA . 416 parts In-Stock

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$34.430

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Aztec Data Supply Inc.

USA . 110 parts In-Stock

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$50.830

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$50.830

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$63.684

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$60.500

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$60.500

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$63.684

$60.500

$60.500

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Microchip USA

USA . 2,509 parts In-Stock

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$99.475

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$99.475

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A-Z Elektronik GmbH

Germany . 10,056 parts In-Stock

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Robosynatics

Brazil . 4,749 parts In-Stock

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Lucentia Tech

USA . 4,749 parts In-Stock

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$64.739

1k+ parts

$63.418

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$63.418

4,749

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$64.739

$63.418

$63.418

Argo Parts USA

USA . 4,539 parts In-Stock

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4,539

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Lixinc

USA . 4,517 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,896 parts In-Stock

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UNI Independent Distributors

Spain . 2,390 parts In-Stock

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Futuretech Components

Singapore . 635 parts In-Stock

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635

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GreenTree Electronics

Israel . 152 parts In-Stock

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ChipstoGo Electronic ltd

UK . 20 parts In-Stock

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Overview

Discover the MIMX8MM6DVTLZAA by NXP Semiconductors - a cutting-edge solution that combines top-quality manufacturing and unmatched performance. With its wide range of applications in the Other Function uPs, uCs & Peripheral ICs category, this product is designed to exceed your expectations. Experience the value it brings with its advanced features, including low power consumption, high reliability, and precise functionality. Unlock endless possibilities with the MIMX8MM6DVTLZAA and stay ahead in today's fast-paced technology-driven world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the product, ensuring a long lifespan and reliability.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the product on a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 1.05 V

With a high maximum supply voltage of 1.05 V, this product can handle higher power requirements, making it suitable for applications that demand robust performance.

Package Shape: SQUARE

The square package shape enables efficient use of space on a circuit board and facilitates easy integration with other components, enhancing the overall design and compactness of the product.

No. of Terminals: 486

With a large number of terminals, this product offers extensive connectivity options, allowing for versatile usage with various external devices or components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures precise and accurate connections, enhancing signal integrity and reducing the risk of interference or data corruption.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement of 0.95 V helps in achieving energy efficiency and reduces power consumption, making this product an ideal choice for power-sensitive applications.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95°C ensures reliable performance even in demanding environments or under heavy loads, making this product suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows this product to function effectively in cold environments without any compromise in performance, expanding its usability in diverse conditions.

Terminal Finish: TIN SILVER

The terminal finish of tin silver provides excellent conductivity, corrosion resistance, and solderability, ensuring secure and stable connections, resulting in reliable and high-quality performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process by allowing easy access for soldering or connection during assembly, increasing efficiency and reducing the risk of errors.

Maximum Seated Height: 1.25 mm

With a compact maximum seated height of 1.25 mm, this product offers a slim profile, enabling its use in space-constrained applications or designs.

Width: 14 mm

The 14 mm width of this product provides a balanced size, offering a good compromise between space utilization and ease of handling or installation.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and connection reliability during the manufacturing process, resulting in a high-quality final product.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for effective and secure soldering, ensuring strong and durable connections, enhancing the overall performance and longevity of the product.

Length: 14 mm

With a length of 14 mm, this product offers a compact and versatile size, suitable for various applications while allowing for flexibility in design and integration.

Peripheral IC Type: SoC

The system-on-chip (SoC) architecture of this peripheral IC enables the integration of multiple functionalities into a single chip, reducing complexity, improving efficiency, and providing enhanced performance in a compact form factor.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption, high noise immunity, and compatibility with a wide range of voltages, making it an energy-efficient and versatile choice for various applications.

Terminal Form: BALL

The ball terminal form enables reliable and robust connections, resisting vibration or mechanical stress, ensuring stable performance even in demanding environments.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V provides a standard and reliable power source for this product, allowing compatibility with various systems and facilitating easy integration.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product offers precise and compact terminal spacing, enabling high-density integration and reducing the footprint on the circuit board, making it suitable for compact designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product has a moderate sensitivity to moisture during handling or storage, requiring appropriate precautions to maintain its performance and reliability.\

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMX8MM6DVTLZAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B486

JESD-609 Code:

e2

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

486

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA486,27X27,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMX8MM6DVTLZAA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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