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AM6231AKGGHHALW

Texas Instruments

AM6231AKGGHHALW by Texas Instruments

AM6231AKGGHHALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 0.715-0.79V. This square-shaped IC is ideal for applications requiring very thin profile and fine pitch grid array packages.

Median Price

$15.979

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,538 parts In-Stock

1+ parts

$10.938

100+ parts

$9.554

1k+ parts

$6.589

10k+ parts

-

1,538

$10.938

$9.554

$6.589

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Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$21.020

100+ parts

$13.860

1k+ parts

$11.950

10k+ parts

-

1

$21.020

$13.860

$11.950

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,943 parts In-Stock

1+ parts

$10.391

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2,943

$10.391

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Vyrian

USA . 7,415 parts In-Stock

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7,415

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VNN

France . 700 parts In-Stock

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700

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Nova Conductors

Japan . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 131 parts In-Stock

1+ parts

$9.300

100+ parts

$9.068

1k+ parts

$9.021

10k+ parts

-

131

$9.300

$9.068

$9.021

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Corphita

USA . 3,318 parts In-Stock

1+ parts

$9.844

100+ parts

-

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3,318

$9.844

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Ampacity Inc.

Singapore . 132 parts In-Stock

1+ parts

$20.240

100+ parts

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132

$20.240

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Corohmni

South Africa . 115 parts In-Stock

1+ parts

$57.525

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115

$57.525

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Parana Technologies

USA . 1,572 parts In-Stock

1+ parts

$60.312

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1,572

$60.312

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ChromeModa Solutions

Germany . 3,765 parts In-Stock

1+ parts

$67.766

100+ parts

$55.568

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10k+ parts

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3,765

$67.766

$55.568

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IDEA Electronic Components Group

UK . 1,674 parts In-Stock

1+ parts

$67.766

100+ parts

$64.378

1k+ parts

$60.989

10k+ parts

-

1,674

$67.766

$64.378

$60.989

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Advanced Electronics

New Zealand . 4,403 parts In-Stock

1+ parts

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4,403

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Argo Parts USA

USA . 2,002 parts In-Stock

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2,002

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DigiPath Technology Company

USA . 1,334 parts In-Stock

1+ parts

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100+ parts

$61.098

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1,334

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$61.098

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Continental Prestige Electronics

USA . 152 parts In-Stock

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152

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the AM6231AKGGHHALW by Texas Instruments. Crafted with precision and quality, this cutting-edge product offers unmatched performance in the category of Other Function uPs,uCs & Peripheral ICs. Whether you're looking to enhance your smart devices or revolutionize your automotive systems, this Texas Instruments gem delivers exceptional value, reliability, and efficiency. Elevate your projects to new heights with the AM6231AKGGHHALW and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, reducing assembly time and ensuring a stable connection.

Maximum Supply Voltage: 0.79 V

Provides a safe operating range for the product, preventing damage from overvoltage situations.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board, maximizing component density.

No. of Terminals: 425

High number of terminals allows for versatile connectivity options and support for complex functions.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with thin profile and fine pitch offers high reliability and performance in a compact form factor.

Minimum Supply Voltage: 0.715 V

Low minimum supply voltage allows for efficient power consumption and extended battery life.

Maximum Operating Temperature: 95 °C

Wide operating temperature range ensures product reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures makes the product suitable for a wide range of applications.

Terminal Position: BOTTOM

Bottom terminal position enables easy installation and maintenance of the product on the circuit board.

Maximum Seated Height: 0.89 mm

Low seated height allows for a compact design, ideal for space-constrained applications.

Width: 13 mm

Narrow width makes the product compatible with standard board layouts and facilitates integration into existing systems.

Length: 13 mm

Compact length enables efficient use of board space and supports dense component placement.

Peripheral IC Type: SoC

System-on-Chip design integrates multiple functions into a single device, reducing component count and improving efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance and reliability.

Nominal Supply Voltage: 0.75 V

Stable nominal supply voltage ensures consistent operation and prevents voltage-related issues.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and efficient heat dissipation, enhancing product reliability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, increasing design flexibility and board space efficiency.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6231AKGGHHALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6231AKGGHHALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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