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AM6231AGGGGHALW

Texas Instruments

AM6231AGGGGHALW by Texas Instruments

AM6231AGGGGHALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 0.715-0.79 V. This grid array IC is ideal for applications requiring very thin profile and fine pitch packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,685 parts In-Stock

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1,685

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Vyrian

USA . 1,148 parts In-Stock

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VNN

France . 920 parts In-Stock

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920

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,402 parts In-Stock

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$5.000

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1,402

$5.000

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AZTECH Wire

Italy . 440 parts In-Stock

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$12.966

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$12.966

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Parana Technologies

USA . 1,062 parts In-Stock

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$18.769

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$1,743.006

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$16.892

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1,062

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$1,743.006

$16.892

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DigiPath Technology Company

USA . 1,740 parts In-Stock

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$20.667

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$20.667

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ChromeModa Solutions

Germany . 2,703 parts In-Stock

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$21.089

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$17.293

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$21.089

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IDEA Electronic Components Group

UK . 1,218 parts In-Stock

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$21.089

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$20.035

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$18.980

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$18.980

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Corohmni

South Africa . 16 parts In-Stock

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$23.154

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Semicontronic

India . 1,514 parts In-Stock

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$31.000

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$30.225

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$30.070

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One Stop Electronics

USA . 861 parts In-Stock

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$35.000

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Continental Prestige Electronics

USA . 6,423 parts In-Stock

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Corphita

USA . 2,843 parts In-Stock

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Argo Parts USA

USA . 613 parts In-Stock

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613

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Elevate your electronic designs with the AM6231AGGGGHALW by Texas Instruments. Crafted with precision and expertise, this cutting-edge peripheral IC offers unparalleled performance and reliability. Whether you're working on IoT devices, wearables, or smart home appliances, this product is designed to optimize functionality and enhance user experience. With a focus on quality and innovation, Texas Instruments delivers value and benefits that set your projects apart. Experience the difference with the AM6231AGGGGHALW – where excellence meets technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the ICs inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.79 V

Efficiently handles power supply up to 0.79 V, suitable for various electronic applications without risk of damage.

Package Shape: SQUARE

Square shape allows for easier handling and placement on PCBs, optimizing space utilization.

No. of Terminals: 425

Large number of terminals provide flexibility in connecting to other components, making it suitable for complex circuit designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This packaging style offers compact design, ideal for applications where space is limited, while ensuring efficient signal routing.

Minimum Supply Voltage: 0.715 V

Low minimum supply voltage allows for operation in low power environments, making it energy-efficient.

Maximum Operating Temperature: 95 °C

With a high operating temperature range of up to 95°C, this IC can perform reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of operating at freezing temperatures, making it suitable for a wide range of applications in different climates.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the PCB, ensuring a secure and stable integration.

Maximum Seated Height: 0.89 mm

Ultra-thin profile with low seated height allows for compact and slim designs in electronic devices.

Width: 13 mm

Narrow width enables space-saving integration on PCBs, ideal for compact electronic devices.

Length: 13 mm

Short length contributes to a smaller footprint on the circuit board, optimizing layout and design efficiency.

Peripheral IC Type: SoC

Integration of various functions into a single System-on-Chip (SoC) enhances performance and reduces the need for additional components, simplifying the overall design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-operated devices and noise-sensitive applications.

Terminal Form: BALL

Ball terminal form facilitates reliable connections and soldering, ensuring a secure and stable electrical interface.

Nominal Supply Voltage: 0.75 V

Nominal supply voltage of 0.75 V provides stable operation within the specified voltage range, ensuring consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting on PCBs, enabling compact designs and efficient use of space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6231AGGGGHALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

No. of Terminals:

425

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6231AGGGGHALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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