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AM6254ATCGHAALW

Texas Instruments

AM6254ATCGHAALW by Texas Instruments

AM6254ATCGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-density integration in a compact form factor.

Median Price

$29.020

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,581 parts In-Stock

1+ parts

$20.453

100+ parts

$17.865

1k+ parts

$12.321

10k+ parts

-

3,581

$20.453

$17.865

$12.321

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DigiKey

USA . 855 parts In-Stock

1+ parts

$29.020

100+ parts

$22.038

1k+ parts

$19.536

10k+ parts

-

855

$29.020

$22.038

$19.536

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Mouser Electronics

USA . 19 parts In-Stock

1+ parts

$31.150

100+ parts

$23.730

1k+ parts

-

10k+ parts

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19

$31.150

$23.730

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,212 parts In-Stock

1+ parts

$19.430

100+ parts

-

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3,212

$19.430

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VNN

France . 4,887 parts In-Stock

1+ parts

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4,887

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Vyrian

USA . 3,448 parts In-Stock

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3,448

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Nova Conductors

Japan . 44 parts In-Stock

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44

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,299 parts In-Stock

1+ parts

$17.390

100+ parts

-

1k+ parts

-

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1,299

$17.390

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Corphita

USA . 2,661 parts In-Stock

1+ parts

$18.408

100+ parts

-

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2,661

$18.408

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Corohmni

South Africa . 300 parts In-Stock

1+ parts

$26.227

100+ parts

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300

$26.227

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Parana Technologies

USA . 508 parts In-Stock

1+ parts

$36.906

100+ parts

-

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508

$36.906

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ChromeModa Solutions

Germany . 1,669 parts In-Stock

1+ parts

$41.467

100+ parts

$34.003

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1,669

$41.467

$34.003

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IDEA Electronic Components Group

UK . 1,206 parts In-Stock

1+ parts

$41.467

100+ parts

$39.394

1k+ parts

$37.320

10k+ parts

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1,206

$41.467

$39.394

$37.320

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Argo Parts USA

USA . 1,537 parts In-Stock

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1,537

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Continental Prestige Electronics

USA . 1,420 parts In-Stock

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1,420

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DigiPath Technology Company

USA . 1,320 parts In-Stock

1+ parts

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$37.387

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1,320

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$37.387

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Experience unparalleled performance and reliability with the AM6254ATCGHAALW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and innovation in all their products. This IC falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for a wide range of applications. With a package style that is grid array, very thin profile, and fine pitch, this product offers maximum efficiency in a compact design. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations and provides exceptional value to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount feature allows for easy and quick installation onto circuit boards, saving time and effort.

Maximum Supply Voltage: 0.79 V

The maximum supply voltage of 0.79 V ensures safe operation and protection of the integrated circuits.

Package Shape: SQUARE

The square package shape provides a compact design, optimizing space on the circuit board.

No. of Terminals: 425

Having 425 terminals allows for a wide range of connectivity options, making the product versatile and adaptable.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers high density and efficient use of space on the board.

Minimum Supply Voltage: 0.715 V

The minimum supply voltage of 0.715 V ensures the product can operate efficiently even with low power input.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the product can withstand high temperature environments.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C makes the product suitable for various climates and conditions.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier connections and soldering during assembly.

Maximum Seated Height: 0.89 mm

The low maximum seated height of 0.89 mm contributes to a slim and compact overall product design.

Width: 13 mm

The 13 mm width offers a balanced form factor, making it suitable for various applications and board sizes.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C ensures reliable soldering and robust mechanical connections.

Length: 13 mm

The 13 mm length provides a square form factor, allowing for efficient layout and placement on the board.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functions into a single chip, reducing overall system complexity and cost.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high speed, and reliability.

Terminal Form: BALL

The ball terminal form enables secure and reliable connections, especially in high vibration environments.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75 V ensures stable and consistent performance of the product.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for fine pitch connections, enabling high-density packaging and miniaturization.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to humidity during manufacturing and storage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM6254ATCGHAALW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

425

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

.89 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

AM6254ATCGHAALW Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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