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MCIMX6S5EVM10AC

NXP Semiconductors

MCIMX6S5EVM10AC by NXP Semiconductors

MCIMX6S5EVM10AC by NXP Semiconductors is a SoC with CMOS technology, featuring 624 terminals in a low profile, fine pitch grid array package. It operates b/w -20 to 105 °C with supply voltage ranging from 1.35V to 1.5V. Ideal for applications requiring high performance and compact design.

Median Price

$32.395

Lifecycle Status

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18

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Arrow

USA . 130 parts In-Stock

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$21.030

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Chip1Stop

Japan . 340 parts In-Stock

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Verical

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DigiKey

USA . 228 parts In-Stock

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$49.390

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Mouser Electronics

USA . 39 parts In-Stock

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Rochester

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Distributors (In-Stock)

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Digiode

USA . 492 parts In-Stock

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$24.320

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Nova Conductors

Japan . 54 parts In-Stock

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Martec Srl

Italy . 5,000 parts In-Stock

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Bristol Electronics

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Chip Stock

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Anansix

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NAC Semi

USA . 960 parts In-Stock

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Flip Electronics

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Vyrian

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Cyclops Electronics Ltd

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Rebound Electronics

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Semicontronic

India . 518 parts In-Stock

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$20.740

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$20.222

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$20.118

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Ampacity Inc.

Singapore . 323 parts In-Stock

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Corphita

USA . 722 parts In-Stock

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Continental Prestige Electronics

USA . 6,056 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Advanced Electronics

New Zealand . 870 parts In-Stock

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Corohmni

South Africa . 267 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,490 parts In-Stock

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Microchip USA

USA . 1,358 parts In-Stock

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Lixinc

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Perfect Parts

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A-Z Elektronik GmbH

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GreenTree Electronics

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Epart123

USA . 3,600 parts In-Stock

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Argo Parts USA

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Speed Components Ltd (Excess)

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Futuretech Components

Singapore . 130 parts In-Stock

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Overview

Unleash the power of innovation with the MCIMX6S5EVM10AC by NXP Semiconductors. This cutting-edge product offers unparalleled quality and reliability, perfect for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. With advanced technology and a sleek design, this device delivers exceptional value and benefits to customers seeking top-notch performance. Elevate your projects with the MCIMX6S5EVM10AC and experience the advantages of NXP Semiconductors' expertise in semiconductor manufacturing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.5 V

The maximum supply voltage of 1.5V allows for safe operation within this range.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space on the PCB.

No. of Terminals: 624

With a high number of terminals, the product can accommodate a wide range of connections and functionality.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style provides high density and reliability in a compact form factor.

Minimum Supply Voltage: 1.35 V

The minimum supply voltage of 1.35V allows for flexibility in power requirements.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliability in various environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20°C allows for operation in cold environments without issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on the PCB.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm enables the product to be used in compact designs.

Width: 21 mm

The 21mm width allows for efficient placement and spacing on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering without damaging the product.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering during assembly.

Length: 21 mm

The 21mm length complements the width, providing a balanced form factor for the product.

Peripheral IC Type: SoC

The System on Chip (SoC) peripheral IC type integrates multiple functions into a single chip, reducing the need for external components.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity in the product.

Terminal Form: BALL

The ball terminal form provides reliable connections and mounting during assembly.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm allows for high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the product has moderate sensitivity to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S5EVM10AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6S5EVM10AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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