Loading...

AM5716AABCXEQ1

Texas Instruments

AM5716AABCXEQ1 by Texas Instruments

AM5716AABCXEQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. With 760 terminals in a GRID ARRAY package style, it has a supply voltage range of 1.11V to 1.2V for versatile usage.

Median Price

$65.008

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 266 parts In-Stock

1+ parts

$65.008

100+ parts

$57.785

1k+ parts

$42.489

10k+ parts

-

266

$65.008

$57.785

$42.489

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,784 parts In-Stock

1+ parts

$61.758

100+ parts

-

1k+ parts

-

10k+ parts

-

3,784

$61.758

-

-

-

Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$66.505

100+ parts

-

1k+ parts

-

10k+ parts

-

60

$66.505

-

-

-

VNN

France . 11,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,513

-

-

-

-

Vyrian

USA . 3,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,800

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 877 parts In-Stock

1+ parts

$18.412

100+ parts

-

1k+ parts

-

10k+ parts

-

877

$18.412

-

-

-

Semicontronic

India . 266 parts In-Stock

1+ parts

$55.260

100+ parts

$53.878

1k+ parts

$53.602

10k+ parts

-

266

$55.260

$53.878

$53.602

-

Parana Technologies

USA . 531 parts In-Stock

1+ parts

$56.711

100+ parts

-

1k+ parts

-

10k+ parts

-

531

$56.711

-

-

-

Corphita

USA . 4,381 parts In-Stock

1+ parts

$58.507

100+ parts

-

1k+ parts

-

10k+ parts

-

4,381

$58.507

-

-

-

DigiPath Technology Company

USA . 2,075 parts In-Stock

1+ parts

$62.446

100+ parts

-

1k+ parts

-

10k+ parts

-

2,075

$62.446

-

-

-

ChromeModa Solutions

Germany . 2,593 parts In-Stock

1+ parts

$63.720

100+ parts

$52.250

1k+ parts

-

10k+ parts

-

2,593

$63.720

$52.250

-

-

IDEA Electronic Components Group

UK . 2,048 parts In-Stock

1+ parts

$63.720

100+ parts

$60.534

1k+ parts

$57.348

10k+ parts

-

2,048

$63.720

$60.534

$57.348

-

Continental Prestige Electronics

USA . 1,973 parts In-Stock

1+ parts

$66.505

100+ parts

-

1k+ parts

-

10k+ parts

$65.175

1,973

$66.505

-

-

$65.175

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$66.505

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$66.505

-

-

-

Corohmni

South Africa . 480 parts In-Stock

1+ parts

$66.505

100+ parts

-

1k+ parts

-

10k+ parts

-

480

$66.505

-

-

-

Ampacity Inc.

Singapore . 266 parts In-Stock

1+ parts

$120.260

100+ parts

-

1k+ parts

-

10k+ parts

-

266

$120.260

-

-

-

Microchip USA

USA . 2,640 parts In-Stock

1+ parts

$133.840

100+ parts

$131.510

1k+ parts

$130.350

10k+ parts

$129.190

2,640

$133.840

$131.510

$130.350

$129.190

Argo Parts USA

USA . 4,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,557

-

-

-

-

Overview

Experience unparalleled performance and reliability with the AM5716AABCXEQ1 by Texas Instruments, a leading manufacturer in the industry. This cutting-edge System on Chip offers a wide range of applications in automotive technology, ensuring top-of-the-line quality and precision. With a focus on innovation and efficiency, this product provides customers with unmatched value and benefits, making it the ideal choice for all your advanced electronic needs. Trust Texas Instruments to deliver excellence with every purchase.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environmental conditions, making this product a reliable choice.

Surface Mount: YES

With the ability to be surface mounted, this product offers easy installation and space-saving benefits in a variety of applications.

Maximum Supply Voltage: 1.2 V

Operating within a maximum supply voltage of 1.2 V provides efficient power consumption and helps prevent damage to the product, making it a safe choice for long-term use.

Screening Level: AEC-Q100

Meeting AEC-Q100 screening level standards ensures high quality and reliability for automotive applications, making this product a trusted option for car electronics.

Package Shape: SQUARE

The square package shape offers a compact design that maximizes board space and allows for efficient layout in electronic systems.

No. of Terminals: 760

With a high number of terminals, this product allows for complex circuit connections, making it suitable for advanced electronic applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style provides high density integration and precise connections, enhancing the overall performance of the product.

Minimum Supply Voltage: 1.11 V

Operating at a minimum supply voltage of 1.11 V ensures energy efficiency and reliable performance even under low power conditions.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables reliable operation in harsh environmental conditions, making this product a resilient choice.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in extreme cold environments, ensuring consistent performance in all conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring a long lifespan for the product.

Terminal Position: BOTTOM

The terminal position at the bottom of the package allows for easy connections and enhances signal integrity, making this product a convenient choice for circuit integration.

Maximum Seated Height: 2.96 mm

With a maximum seated height of 2.96 mm, this product offers a low profile design that is ideal for compact electronic devices.

Width: 23 mm

The width of 23 mm provides a balance of size and space optimization, allowing for versatile integration in various electronic applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during assembly, making this product easy to work with.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this product can withstand high-temperature soldering processes, ensuring quality manufacturing and durability.

Length: 23 mm

The length of 23 mm offers a compact form factor that is suitable for space-constrained applications, making this product a versatile choice for different electronic designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets stringent temperature grade requirements, ensuring reliable performance in vehicles and other automotive systems.

Peripheral IC Type: SYSTEM ON CHIP

Featuring a system-on-chip peripheral IC type, this product offers integrated functionality and improved performance, making it a cost-effective solution for diverse electronic applications.

Technology: CMOS

Built with CMOS technology, this product delivers low power consumption and high-speed performance, making it an energy-efficient and reliable choice for various electronic systems.

Terminal Form: BALL

The terminal form of ball enhances solder joint reliability and ease of assembly, ensuring quality connections for stable performance of the product.

Nominal Supply Voltage: 1.15 V

Operating at a nominal supply voltage of 1.15 V provides a balance between power efficiency and performance, making this product suitable for a wide range of electronic devices.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this product offers precise connections and high-density integration, enabling versatile applications in electronics design.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 ensures proper handling and storage requirements, protecting the product from moisture-related damage and ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5716AABCXEQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5716AABCXEQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 12