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AM5716AABCDEA

Texas Instruments

AM5716AABCDEA by Texas Instruments

AM5716AABCDEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

Median Price

$42.851

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 602 parts In-Stock

1+ parts

$42.851

100+ parts

$38.090

1k+ parts

$28.007

10k+ parts

-

602

$42.851

$38.090

$28.007

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,179 parts In-Stock

1+ parts

$40.708

100+ parts

-

1k+ parts

-

10k+ parts

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2,179

$40.708

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Vyrian

USA . 6,898 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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6,898

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 800 parts In-Stock

1+ parts

$3.347

100+ parts

-

1k+ parts

-

10k+ parts

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800

$3.347

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-

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AZTECH Wire

Italy . 742 parts In-Stock

1+ parts

$19.800

100+ parts

-

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742

$19.800

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Corphita

USA . 2,292 parts In-Stock

1+ parts

$38.566

100+ parts

-

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2,292

$38.566

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-

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Parana Technologies

USA . 1,129 parts In-Stock

1+ parts

$69.341

100+ parts

-

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1,129

$69.341

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DigiPath Technology Company

USA . 803 parts In-Stock

1+ parts

$76.353

100+ parts

-

1k+ parts

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803

$76.353

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ChromeModa Solutions

Germany . 1,931 parts In-Stock

1+ parts

$77.911

100+ parts

$63.887

1k+ parts

-

10k+ parts

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1,931

$77.911

$63.887

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IDEA Electronic Components Group

UK . 1,918 parts In-Stock

1+ parts

$77.911

100+ parts

$74.015

1k+ parts

$70.120

10k+ parts

-

1,918

$77.911

$74.015

$70.120

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Microchip USA

USA . 1,628 parts In-Stock

1+ parts

$94.100

100+ parts

$92.470

1k+ parts

$91.650

10k+ parts

$90.830

1,628

$94.100

$92.470

$91.650

$90.830

Native Components

USA . 142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.951

10k+ parts

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142

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$2.951

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Overview

Unlock the power of cutting-edge technology with the AM5716AABCDEA by Texas Instruments. Designed to meet the highest standards of quality and reliability, this innovative product offers a wide range of applications in various industries. With Texas Instruments' reputation for excellence, customers can trust in the value and benefits that come with choosing this product. Experience seamless performance and efficiency like never before with the AM5716AABCDEA, setting new standards in the world of Other Function uPs,uCs & Peripheral ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs.

Maximum Supply Voltage: 1.2 V

Supports a wide range of power supply options while ensuring proper functionality.

Package Shape: SQUARE

Square package shape facilitates easier placement and alignment during assembly.

No. of Terminals: 760

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch design enhance signal integrity and reliability.

Minimum Supply Voltage: 1.11 V

Low minimum supply voltage minimizes power consumption and heat dissipation.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures stability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing.

Maximum Seated Height: 2.96 mm

Low profile design saves space and allows for compact device designs.

Width: 23 mm

Optimal width for compatibility with standard PCB layouts and form factors.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures proper soldering and joint reliability.

Length: 23 mm

Compact length for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in rugged environments.

Peripheral IC Type: SYSTEM ON CHIP

Integration of multiple functions into a single chip reduces component count and improves efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form enables easy and reliable connections on the PCB.

Nominal Supply Voltage: 1.15 V

Optimal nominal supply voltage for stable and efficient operation.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product is moderately sensitive to moisture, suitable for standard manufacturing processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AM5716AABCDEA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5716AABCDEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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