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XCZU9CG-1FFVB1156I

Xilinx

XCZU9CG-1FFVB1156I by Xilinx

XCZU9CG-1FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

Median Price

$4,458.140

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DigiKey

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Digiode

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Nova Conductors

Japan . 99 parts In-Stock

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VNN

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Vyrian

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AZTECH Wire

Italy . 281 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Aztec Data Supply Inc.

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Qasali Group International

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Modulus Dynamics

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One Stop Electronics

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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$4,011.866

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Semicontronic

India . 2 parts In-Stock

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Netroflash

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Supply Digital

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Overview

Unlock the power of cutting-edge technology with the XCZU9CG-1FFVB1156I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers exceptional quality and innovation in the category of Other Function uPs,uCs & Peripheral ICs. With its advanced features and versatile applications, this product offers unmatched value and benefits to customers. Experience seamless performance and reliability for all your microprocessor circuit needs with the XCZU9CG-1FFVB1156I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making this product a reliable choice.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it convenient for integration into various systems.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, ensuring flexibility in different applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy placement on circuit boards, optimizing the overall design layout.

No. of Terminals: 1156

The high number of terminals provides ample connectivity options, allowing for versatile configurations and functionalities.

Package Style (Meter): GRID ARRAY

The grid array package style offers increased stability and robustness, ensuring secure connections and reliable performance.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures energy efficiency and compatibility with a variety of power sources, making it a versatile choice.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and prolonged use without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in cold environments, expanding the range of applications this product can be used in.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of these materials for terminal finish provides corrosion resistance and reliable electrical connections, enhancing the longevity of the product.

Terminal Position: BOTTOM

The bottom terminal position allows for easy mounting and secure placement on circuit boards, ensuring stability and connectivity.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time reduces the risk of heat damage to the components during assembly, ensuring the product's longevity and reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures thorough soldering and secure connections, preventing any potential issues with loose connections or electrical failures.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in harsh operating conditions, making this product suitable for a wide range of industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

With a microprocessor circuit as the peripheral IC type, this product offers advanced computing capabilities and enhanced performance for complex tasks.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high speed, and reliable operation, making it an efficient and dependable choice.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation, ensuring stable performance and longevity of the product.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85V ensures compatibility with a wide range of power sources, offering flexibility in various applications.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this product is suitable for use in environments with moderate exposure to moisture, ensuring long-term durability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU9CG-1FFVB1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU9CG-1FFVB1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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