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XCZU5CG-L2SFVC784E

Xilinx

XCZU5CG-L2SFVC784E by Xilinx

XCZU5CG-L2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 784 terminals in a GRID ARRAY package style. Suitable for applications requiring low supply voltage of 0.72 V and high peak reflow temperature of 250°C, making it ideal for advanced electronic systems.

Median Price

$2,422.830

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 200 parts In-Stock

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$2,422.830

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Vyrian

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Digiode

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One Stop Electronics

USA . 1,379 parts In-Stock

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$6.000

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Semicontronic

India . 1,320 parts In-Stock

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$7.760

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AZTECH Wire

Italy . 597 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,307 parts In-Stock

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Ampacity Inc.

Singapore . 1,407 parts In-Stock

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MARBEL Systems

Belgium . 529 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Texas Native Microelectronics

USA . 827 parts In-Stock

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$43.378

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Corohmni

South Africa . 2,381 parts In-Stock

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Kenton Components

USA . 120 parts In-Stock

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$52.054

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$45.807

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Modulus Dynamics

Lithuania . 1,158 parts In-Stock

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$108.342

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Qasali Group International

UK . 1,129 parts In-Stock

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Microchip USA

USA . 2,579 parts In-Stock

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Argo Parts USA

USA . 4,277 parts In-Stock

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$2,378.640

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$2,354.853

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$2,331.067

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$2,307.281

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Continental Prestige Electronics

USA . 1,101 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Netroflash

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Supply Digital

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Corphita

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Vigor

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Overview

Looking to elevate your electronic designs to the next level? Look no further than the XCZU5CG-L2SFVC784E by Xilinx. With a reputation for top-quality products and cutting-edge technology, Xilinx delivers unmatched performance and reliability in the realm of Other Function uPs,uCs & Peripheral ICs. This powerful microprocessor circuit boasts a variety of applications and benefits, offering customers exceptional value and advantages in their projects. Upgrade to the XCZU5CG-L2SFVC784E today and experience the difference Xilinx can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Package Shape: SQUARE

Helps in saving space and creating a compact design.

No. of Terminals: 784

Allows for a high level of connectivity and functionality.

Package Style (Meter): GRID ARRAY

Enhances the electrical performance and reliability of the product.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Facilitates easy soldering and connections.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering without damaging the components.

Peak Reflow Temperature °C: 250

Suitable for lead-free soldering processes.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Enables advanced processing capabilities and functions.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: BALL

Facilitates easy connections and soldering onto the PCB.

Nominal Supply Voltage: 0.72 V

Efficiently operates at a low voltage for power savings.

Moisture Sensitivity Level (MSL): 4

Indicates low sensitivity to moisture and environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5CG-L2SFVC784E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU5CG-L2SFVC784E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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