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MIMXRT1064CVJ5A

NXP Semiconductors

MIMXRT1064CVJ5A by NXP Semiconductors

NXP Semiconductors' MIMXRT1064CVJ5A is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a voltage range of 1.15-1.26V and peak reflow temp of 260°C. Ideal for industrial applications requiring high-performance microcontrollers.

Median Price

$10.470

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$10.470

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Anansix

USA . 1,811 parts In-Stock

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Digiode

USA . 1,371 parts In-Stock

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Vyrian

USA . 1,363 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 323 parts In-Stock

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$5.793

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Continental Prestige Electronics

USA . 4,409 parts In-Stock

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$10.261

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Netroflash

USA . 1,000 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$10.679

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$10.679

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$10.679

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70

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One Stop Electronics

USA . 1,263 parts In-Stock

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$15.000

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Ampacity Inc.

Singapore . 1,320 parts In-Stock

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$30.000

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Corohmni

South Africa . 73 parts In-Stock

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Aztec Data Supply Inc.

USA . 239 parts In-Stock

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$82.270

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Argo Parts USA

USA . 4,708 parts In-Stock

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UNI Independent Distributors

Spain . 2,510 parts In-Stock

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Corphita

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Overview

Discover the power and precision of the MIMXRT1064CVJ5A by NXP Semiconductors, a cutting-edge solution in the realm of Other Function uPs,uCs & Peripheral ICs. Boasting top-notch quality and reliability from a trusted manufacturer, this innovative product offers unparalleled performance and versatility for a wide range of applications. With a sleek design and advanced technology, this SoC is sure to elevate your projects to new heights. Experience the value and benefits firsthand - unlock endless possibilities with the MIMXRT1064CVJ5A.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for more efficient assembly processes and better utilization of PCB space.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape provides a compact and uniform footprint for easier PCB layout.

No. of Terminals: 196

With a high number of terminals, this product offers versatile connectivity options.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style allows for high density integration and space efficiency.

Minimum Supply Voltage: 1.15 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this product suitable for industrial environments with demanding temperature requirements.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB assembly and allows for more efficient heat dissipation.

Maximum Seated Height: 1.52 mm

The low maximum seated height enables a slim and compact overall design of the product.

Width: 12 mm

The 12mm width offers a balanced size profile for easy integration into various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 40

The product can withstand peak reflow temperatures for up to 40 seconds, allowing for efficient soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable solder connections and durability during manufacturing.

Length: 12 mm

The 12mm length provides a compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade specifications make this product suitable for rugged and challenging operating conditions.

Peripheral IC Type: SoC

The integration of System on Chip (SoC) technology offers enhanced functionality and performance in a single package.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity for improved efficiency.

Terminal Form: BALL

The use of ball terminals ensures reliable electrical connections and ease of assembly.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for high-density mounting and efficient use of PCB space.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the product is sensitive to moisture but can be safely handled and stored with proper precautions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MIMXRT1064CVJ5A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B196

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,31

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

SoC

Trade Compliance

MIMXRT1064CVJ5A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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