Loading...

MFRC52201HN1,118

NXP Semiconductors

MFRC52201HN1,118 by NXP Semiconductors

The NXP Semiconductors MFRC52201HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE CHIP CARRIER package. It operates at -25 to 85 °C and requires 3/3.3V power supply. Ideal for applications requiring contactless communication such as RFID systems and access control devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,092

-

-

-

-

Digiode

USA . 3,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,615

-

-

-

-

Anansix

USA . 2,799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,799

-

-

-

-

Nova Conductors

Japan . 31 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

31

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$12.360

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$12.360

-

-

-

Aztec Data Supply Inc.

USA . 1,212 parts In-Stock

1+ parts

$16.990

100+ parts

-

1k+ parts

-

10k+ parts

-

1,212

$16.990

-

-

-

One Stop Electronics

USA . 906 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

-

10k+ parts

-

906

$17.000

-

-

-

Semicontronic

India . 459 parts In-Stock

1+ parts

$23.000

100+ parts

$22.425

1k+ parts

$22.310

10k+ parts

-

459

$23.000

$22.425

$22.310

-

Ampacity Inc.

Singapore . 328 parts In-Stock

1+ parts

$23.000

100+ parts

-

1k+ parts

-

10k+ parts

-

328

$23.000

-

-

-

Advanced Electronics

New Zealand . 2,055 parts In-Stock

1+ parts

$39.355

100+ parts

$38.961

1k+ parts

$37.387

10k+ parts

-

2,055

$39.355

$38.961

$37.387

-

Corohmni

South Africa . 3,047 parts In-Stock

1+ parts

$79.130

100+ parts

-

1k+ parts

-

10k+ parts

-

3,047

$79.130

-

-

-

Corphita

USA . 4,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,406

-

-

-

-

Argo Parts USA

USA . 3,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,080

-

-

-

-

Continental Prestige Electronics

USA . 2,842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,842

-

-

-

-

UNI Independent Distributors

Spain . 1,916 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,916

-

-

-

-

Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Enhance your electronics projects with the top-notch quality of the NXP Semiconductors MFRC52201HN1,118. As a leading manufacturer in the industry, NXP Semiconductors delivers unmatched reliability and innovation in their products. This versatile peripheral IC is ideal for a wide range of applications, offering customers exceptional value and advantages. Explore the endless possibilities with the MFRC52201HN1,118 and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy installation and integration into circuit boards.

Package Shape: SQUARE

Optimal shape for efficient use of space on the circuit board.

Power Supplies (V): 3/3.3

Compatible with standard power supplies, ensuring ease of use.

No. of Terminals: 32

Provides sufficient connectivity options for various applications.

Package Style (Meter): CHIP CARRIER

Enhances thermal performance and reliability of the product.

Maximum Operating Temperature: 85 °C

Ensures stable operation even in high-temperature environments.

Minimum Operating Temperature: -25 °C

Can withstand low temperatures, making it suitable for diverse operating conditions.

Terminal Position: QUAD

Facilitates easy connectivity and installation on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures efficient soldering during the assembly process.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering without damage.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Provides advanced processing capabilities for various applications.

Terminal Form: NO LEAD

Improves reliability and connectivity compared to traditional lead terminals.

Maximum Supply Current: 100 mA

Efficiently manages power consumption for optimal performance.

Terminal Pitch: 0.5 mm

Allows for precise and compact connections on the circuit board.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC52201HN1,118 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

100 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

MFRC52201HN1,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 16