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MFRC53001T/0FE,118

NXP Semiconductors

MFRC53001T/0FE,118 by NXP Semiconductors

MFRC53001T/0FE,118 by NXP Semiconductors is a microprocessor circuit in a small outline package, operating b/w -25 °C to 85 °C. It features 32 terminals with a nominal voltage of 5V and max current of 40mA. Ideal for RFID applications, it supports surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,894 parts In-Stock

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2,894

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Anansix

USA . 2,792 parts In-Stock

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2,792

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Vyrian

USA . 2,014 parts In-Stock

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2,014

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One Stop Electronics

USA . 166 parts In-Stock

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$6.000

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166

$6.000

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Corohmni

South Africa . 2,989 parts In-Stock

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$19.487

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2,989

$19.487

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UNI Independent Distributors

Spain . 2,319 parts In-Stock

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2,319

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Corphita

USA . 541 parts In-Stock

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541

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Overview

Unlock innovative possibilities with the MFRC53001T/0FE,118 from NXP Semiconductors! This high-quality microprocessor circuit is designed for diverse applications, ensuring reliability and performance in a compact package. With NXP's renowned expertise in semiconductor technology, you gain not just a product but a trusted partner in your projects. Experience enhanced efficiency, low power consumption, and seamless integration that drives your success forward. Choose excellence; choose NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capabilities enable compact designs and improve manufacturing efficiency, allowing for high-density circuit layouts.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient PCB layout, optimizing space and facilitating better circuit design.

Power Supplies (V): 5

The 5V power supply is a standard in many electronic devices, ensuring compatibility and ease of integration.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, enabling flexible interfacing with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving advantages, critical for modern electronics that require compact footprints.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is reliable in moderately high-temperature environments, extending its use cases.

Minimum Operating Temperature: -25 °C

The ability to operate at -25 °C makes this product suitable for applications in colder environments, increasing its versatility.

Terminal Position: DUAL

Dual terminal positioning allows for better placement options on PCBs, improving layout efficiency and accessibility.

Peak Reflow Temperature °C: 250

A peak reflow temperature of 250 °C ensures compatibility with standard soldering processes, enhancing manufacturing reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product can handle processing tasks efficiently, making it suitable for a variety of control applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability and are easier to inspect post-assembly, ensuring quality and durability.

Maximum Supply Current: 40 mA

With a maximum supply current of 40 mA, this product is power-efficient and suitable for low-power applications.

Nominal Supply Voltage: 5 V

The nominal 5V supply voltage is widely used, facilitating easier design integration and compatibility with numerous devices.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is well-suited for high-density layouts, allowing for more terminals in a smaller area, which is a significant strength in modern electronics.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC53001T/0FE,118 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

MFRC53001T/0FE,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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