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MFRC63102HN,557

NXP Semiconductors

MFRC63102HN,557 by NXP Semiconductors

MFRC63102HN,557 by NXP Semiconductors is a microprocessor circuit in a square chip carrier package. It operates at 5V with a max current of 20mA and supports temperatures from -25 °C to 85 °C. Ideal for RFID applications, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,924 parts In-Stock

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Digiode

USA . 3,457 parts In-Stock

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Anansix

USA . 1,203 parts In-Stock

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One Stop Electronics

USA . 383 parts In-Stock

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$2.000

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383

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AZTECH Wire

Italy . 833 parts In-Stock

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$12.030

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833

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Corohmni

South Africa . 2,714 parts In-Stock

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$58.225

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Corphita

USA . 1,574 parts In-Stock

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UNI Independent Distributors

Spain . 964 parts In-Stock

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Overview

Unlock seamless connectivity and efficiency with the MFRC63102HN,557 from NXP Semiconductors. Renowned for their innovation and reliability, NXP delivers a versatile microprocessor circuit designed to excel in various applications, from smart cards to IoT devices. With robust performance in extreme temperatures and a compact design, this chip enhances your projects while maximizing value and reliability. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy packaging ensures reliable performance and protection against environmental factors, making this product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology facilitates compact designs and efficient assembly processes, allowing for high-density circuit board layouts.

Package Shape: SQUARE

The square package shape helps optimize board space and simplifies thermal management, making it easier to integrate with other components.

Power Supplies (V): 5

Operating at a standard 5V supply voltage enhances compatibility with many systems and simplifies power management.

No. of Terminals: 32

With 32 terminals, this microprocessor circuit provides ample connectivity options for various peripheral devices and supports complex functionalities.

Package Style (Meter): CHIP CARRIER

The chip carrier style is well-suited for high-performance applications, allowing for efficient heat dissipation and improved electrical performance.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in demanding environments, making this product ideal for industrial and automotive applications.

Minimum Operating Temperature: -25 °C

The capability to function at temperatures as low as -25 °C allows for usage in harsh conditions, increasing the versatility of this product.

Terminal Position: QUAD

The quad terminal positioning offers better layout flexibility and easier routing on printed circuit boards (PCBs).

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this IC is capable of handling complex tasks efficiently, making it suitable for a wide range of applications.

Terminal Form: NO LEAD

Leadless terminals enhance reliability and reduce the risk of solder joint failure, which is beneficial for high-reliability applications.

Maximum Supply Current: 20 mA

With a maximum supply current of 20 mA, this product offers low power consumption, contributing to energy-efficient designs.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V promotes easy interfacing with standard microcontroller and digital systems.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is suitable for high-density applications, allowing for a compact design while maintaining performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC63102HN,557 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

20 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

MFRC63102HN,557 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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