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MFRC53001T/0FE,518

NXP Semiconductors

MFRC53001T/0FE,518 by NXP Semiconductors

MFRC53001T/0FE,518 by NXP Semiconductors is a microprocessor circuit with a 5V supply and operates b/w -25 °C to 85 °C. It features a compact rectangular package with 32 terminals and supports surface mount technology. Ideal for various peripheral applications, it ensures efficient performance in constrained spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,550 parts In-Stock

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Vyrian

USA . 3,317 parts In-Stock

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Anansix

USA . 2,796 parts In-Stock

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AZTECH Wire

Italy . 368 parts In-Stock

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$8.930

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One Stop Electronics

USA . 697 parts In-Stock

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$13.000

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697

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Corohmni

South Africa . 255 parts In-Stock

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$32.107

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255

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UNI Independent Distributors

Spain . 5,398 parts In-Stock

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Corphita

USA . 4,891 parts In-Stock

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Overview

Unlock the potential of your projects with the MFRC53001T/0FE,518 from NXP Semiconductors. Renowned for precision and reliability, NXP delivers cutting-edge technology ideal for diverse applications, from smart access solutions to advanced RFID systems. This robust microprocessor circuit offers exceptional performance in demanding environments, ensuring longevity and efficiency. Experience unparalleled value, enhanced functionality, and peace of mind with a trusted leader in semiconductor innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology enables smaller circuit designs and efficient assembly processes, resulting in lower manufacturing costs and improved performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and better integration into various layouts, contributing to versatile design options.

Power Supplies (V): 5

Operating at a standard 5V makes this product widely compatible with existing systems, reducing the need for additional voltage regulation.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for peripherals and devices, supporting diverse functionality in applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable board space and enables compact device design, essential for modern electronics.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product is robust enough for various applications, including industrial environments.

Minimum Operating Temperature: -25 °C

Its capability to function at -25 °C allows for use in colder climates and harsher environments, widening its application scope.

Terminal Position: DUAL

Dual terminal positioning facilitates easy PCB layout and integration, enhancing design flexibility for engineers.

Peak Reflow Temperature °C: 250

The peak reflow temperature capability of 250 °C ensures compatibility with standard soldering processes, aiding reliability in assembly.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, it offers powerful processing capabilities suitable for a wide range of control applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint security and are easier to inspect post-assembly, promoting manufacturing quality.

Maximum Supply Current: 40 mA

A maximum supply current of 40 mA ensures efficient power consumption while meeting the needs of various peripheral devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V aligns with common digital logic levels, simplifying design integration and enhancing compatibility.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standardized spacing that facilitates easy assembly and alignment on PCBs, improving manufacturing efficiency.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, proper handling and storage precautions are manageable, ensuring product longevity and performance in humidity-sensitive applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MFRC53001T/0FE,518 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

40 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

MFRC53001T/0FE,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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