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OMAPL138EZWTD4E

Texas Instruments

OMAPL138EZWTD4E by Texas Instruments

OMAPL138EZWTD4E by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 50 MHz Max Clock Frequency. It operates in an INDUSTRIAL temperature grade range of -40 to 90 °C, suitable for applications requiring high-speed processing and connectivity via I2C, SPI, UART, and USB interfaces.

Median Price

$31.636

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 281 parts In-Stock

1+ parts

$26.022

100+ parts

$22.730

1k+ parts

$15.676

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281

$26.022

$22.730

$15.676

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Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$37.250

100+ parts

$25.580

1k+ parts

$25.570

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90

$37.250

$25.580

$25.570

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Distributors (In-Stock)

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Digiode

USA . 380 parts In-Stock

1+ parts

$24.721

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380

$24.721

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Nova Conductors

Japan . 50 parts In-Stock

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$28.590

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50

$28.590

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Chip Stock

USA . 5,990 parts In-Stock

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5,990

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Vyrian

USA . 3,980 parts In-Stock

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3,980

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Distributors (Availability)

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AZTECH Wire

Italy . 571 parts In-Stock

1+ parts

$8.513

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-

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571

$8.513

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Component Stockers USA

USA . 151 parts In-Stock

1+ parts

$16.640

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151

$16.640

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Ampacity Inc.

Singapore . 173 parts In-Stock

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$22.120

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173

$22.120

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Semicontronic

India . 173 parts In-Stock

1+ parts

$22.120

100+ parts

$21.567

1k+ parts

$21.456

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173

$22.120

$21.567

$21.456

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Corphita

USA . 1,511 parts In-Stock

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$23.420

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$23.420

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Corohmni

South Africa . 469 parts In-Stock

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$28.590

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469

$28.590

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Bastille Electronics

Australia . 120 parts In-Stock

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$28.590

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$27.160

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$25.445

120

$28.590

$27.160

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$25.445

Continental Prestige Electronics

USA . 1,084 parts In-Stock

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$28.590

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$28.018

1,084

$28.590

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$28.018

Parana Technologies

USA . 547 parts In-Stock

1+ parts

$67.463

100+ parts

$6,264.953

1k+ parts

$60.717

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547

$67.463

$6,264.953

$60.717

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DigiPath Technology Company

USA . 1,983 parts In-Stock

1+ parts

$74.285

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$68.342

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1,983

$74.285

$68.342

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ChromeModa Solutions

Germany . 4,096 parts In-Stock

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$75.801

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$62.157

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$75.801

$62.157

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IDEA Electronic Components Group

UK . 659 parts In-Stock

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$75.801

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$72.011

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$68.221

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659

$75.801

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$68.221

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Lixinc

USA . 12,945 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 1,680 parts In-Stock

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Advanced Electronics

New Zealand . 750 parts In-Stock

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750

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Argo Parts USA

USA . 590 parts In-Stock

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590

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Overview

Enhance your electronic projects with the OMAPL138EZWTD4E by Texas Instruments, a top-tier manufacturer renowned for quality and innovation. This versatile microprocessor circuit offers a wide range of applications in the realm of Other Function uPs,uCs & Peripheral ICs, providing customers with reliable performance and seamless integration. Experience the value and benefits of this product as it delivers exceptional efficiency and functionality, making it a valuable asset for your projects. Upgrade your creations with the OMAPL138EZWTD4E and unlock endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

These materials offer a good balance of strength and affordability, making the product durable and cost-effective.

Surface Mount: YES

Surface mount technology allows for efficient placement of components on the PCB, saving space and enabling automated assembly.

Maximum Supply Voltage: 1.35 V

The high maximum supply voltage provides flexibility in power input options for the product.

Package Shape: SQUARE

The square shape helps with space efficiency and alignment during manufacturing and assembly processes.

No. of Terminals: 361

With a large number of terminals, this product can support a wide range of connections and functionalities.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density and precise component placement, enhancing performance and reliability.

Minimum Supply Voltage: 1.25 V

The low minimum supply voltage allows for efficient power consumption and operation in various power conditions.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, enhancing the longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easy accessibility and connection on the PCB.

Maximum Seated Height: 1.4 mm

The low profile design with maximum seated height helps in compact product design and efficient PCB layout.

Width: 16 mm

The optimal width dimension allows for easy integration into various electronic devices.

External Data Bus Width: 32

The wide data bus width enables high-speed data transfer and efficient communication within the product.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency supports fast processing speed and real-time operation of the product.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the product can withstand peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable soldering and assembly of the product on the PCB.

Length: 16 mm

The compact length dimension facilitates space-saving integration and efficient board layout.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit type enhances the product's processing capabilities and allows for advanced functionalities.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, improving overall efficiency and reliability.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy soldering during assembly.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage specification provides a stable operating voltage for the product's components.

Bus Compatibility: I2C; SPI; UART; USB

Compatibility with multiple bus protocols enhances connectivity options and communication capabilities of the product.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high density mounting on the PCB, saving space and improving overall performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the product's moderate sensitivity to moisture, requiring proper handling during storage and assembly.

Speed: 456 rpm

The high speed rating indicates the product's ability to process data quickly and efficiently, suitable for demanding applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL138EZWTD4E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL138EZWTD4E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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