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OMAPL132BZWTA2

Texas Instruments

OMAPL132BZWTA2 by Texas Instruments

OMAPL132BZWTA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 361 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.95V to 1.2V and is suitable for applications requiring low profile, fine pitch ICs. With CMOS technology and TIN SILVER COPPER finish, it offers high performance in compact designs.

Median Price

$18.660

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$16.150

1k+ parts

$14.450

10k+ parts

$13.600

48

-

$16.150

$14.450

$13.600

DigiKey

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$18.660

1k+ parts

-

10k+ parts

-

48

-

$18.660

-

-

Verical

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$20.188

1k+ parts

$18.063

10k+ parts

$17.000

48

-

$20.188

$18.063

$17.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 199 parts In-Stock

1+ parts

$17.043

100+ parts

-

1k+ parts

-

10k+ parts

-

199

$17.043

-

-

-

Vyrian

USA . 4,313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,313

-

-

-

-

DigiKey Marketplace

USA . 48 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

48

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 48 parts In-Stock

1+ parts

$15.250

100+ parts

-

1k+ parts

-

10k+ parts

-

48

$15.250

-

-

-

Corphita

USA . 4,858 parts In-Stock

1+ parts

$16.146

100+ parts

-

1k+ parts

-

10k+ parts

-

4,858

$16.146

-

-

-

Parana Technologies

USA . 2,152 parts In-Stock

1+ parts

$36.518

100+ parts

-

1k+ parts

-

10k+ parts

-

2,152

$36.518

-

-

-

Corohmni

South Africa . 77 parts In-Stock

1+ parts

$39.346

100+ parts

-

1k+ parts

-

10k+ parts

-

77

$39.346

-

-

-

DigiPath Technology Company

USA . 839 parts In-Stock

1+ parts

$40.210

100+ parts

-

1k+ parts

-

10k+ parts

-

839

$40.210

-

-

-

ChromeModa Solutions

Germany . 3,791 parts In-Stock

1+ parts

$41.031

100+ parts

$33.645

1k+ parts

-

10k+ parts

-

3,791

$41.031

$33.645

-

-

IDEA Electronic Components Group

UK . 434 parts In-Stock

1+ parts

$41.031

100+ parts

$38.979

1k+ parts

$36.928

10k+ parts

-

434

$41.031

$38.979

$36.928

-

Microchip USA

USA . 391 parts In-Stock

1+ parts

$48.220

100+ parts

$47.530

1k+ parts

$47.180

10k+ parts

$46.840

391

$48.220

$47.530

$47.180

$46.840

Perfect Parts

USA . 78 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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78

-

-

-

-

Overview

Elevate your electronic designs with the OMAPL132BZWTA2 by Texas Instruments, a cutting-edge solution in the realm of Other Function uPs,uCs & Peripheral ICs. Crafted with precision and expertise, Texas Instruments delivers unparalleled quality and reliability in every product. This versatile microprocessor circuit boasts a range of applications, offering customers seamless integration and superior performance. Experience the value and benefits of this innovative technology, designed to elevate your projects to new heights. Choose Texas Instruments for excellence in electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05V ensures safe operation and protection for the integrated circuits.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the circuit board.

Power Supplies (V): 1.2,1.8/3.3

The multiple power supply options provide flexibility in designing and powering the product.

No. of Terminals: 361

The high number of terminals allow for a wide range of connections and functionalities within the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package style enables a compact and high-density integration of components.

Minimum Supply Voltage: 0.95 V

The minimum supply voltage of 0.95V ensures that the product can operate efficiently even at lower power levels.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

The terminals positioned at the bottom of the package allow for easier and more secure soldering connections.

Maximum Seated Height: 1.4 mm

The low maximum seated height helps in reducing the overall profile of the product, suitable for slim devices.

Width: 16 mm

The compact width of 16mm enables space-saving integration of the product into electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering connections without damaging the components.

Length: 16 mm

The compact length of 16mm complements the square package shape for efficient space utilization.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC provides advanced processing capabilities and functionality to the product.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures easy and reliable connections during the soldering process.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V provides a stable operating voltage for the integrated circuits, ensuring consistent performance.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting and connection of the product.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has moderate sensitivity to moisture, suitable for standard assembly and storage conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs OMAPL132BZWTA2 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.2 V TYP

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

OMAPL132BZWTA2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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