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XC7Z030-2SBG485I

Xilinx

XC7Z030-2SBG485I by Xilinx

XC7Z030-2SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This GRID ARRAY package has 485 terminals and is ideal for various applications requiring high-performance uPs/uCs & Peripheral ICs.

Median Price

$430.300

Lifecycle Status

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10

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Farnell

UK . 52 parts In-Stock

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DigiKey

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Element14

Singapore . 52 parts In-Stock

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Digiode

USA . 343 parts In-Stock

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VNN

France . 777 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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Chip Stock

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Vyrian

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Touchstone Systems

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 880 parts In-Stock

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$9.313

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MARBEL Systems

Belgium . 108 parts In-Stock

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Texas Native Microelectronics

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Corohmni

South Africa . 268 parts In-Stock

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Kenton Components

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Aztec Data Supply Inc.

USA . 4,308 parts In-Stock

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Modulus Dynamics

Lithuania . 558 parts In-Stock

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Qasali Group International

UK . 3,507 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

India . 34 parts In-Stock

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Vigor

Singapore . 437 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

USA . 166 parts In-Stock

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Lixinc

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Futuretech Components

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Supply Digital

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GreenTree Electronics

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Robosynatics

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Lucentia Tech

USA . 200 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the XC7Z030-2SBG485I by Xilinx. As a leader in the industry, Xilinx delivers top-quality products that guarantee reliability and performance. Ideal for a wide range of applications, this versatile product offers unmatched value and benefits to customers. Experience seamless integration and enhanced efficiency with the XC7Z030-2SBG485I, setting new standards in the world of Other Function uPs,uCs & Peripheral ICs. Join the Xilinx revolution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic devices, saving time and costs during manufacturing.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for versatility in power input options, accommodating a wide range of applications.

Package Shape: SQUARE

The square shape of the package is compact and space-saving, making it suitable for applications where size constraints are a consideration.

No. of Terminals: 485

The high number of terminals allows for a greater number of connections and functionalities, increasing the product's capabilities and versatility.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and a more reliable connection, ensuring better performance of the product.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in portable electronic devices.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability and stability in extreme environmental conditions, making the product suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments without any performance issues.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB layout and allows for a more compact design of the electronic device.

Maximum Seated Height: 2.44 mm

The low maximum seated height enables a slim and sleek profile for the electronic device, which is desirable in modern consumer electronics.

Width: 19 mm

The compact width dimension allows for a smaller footprint of the product, making it easier to integrate into various electronic devices.

Length: 19 mm

The compact length dimension contributes to the overall space-saving design of the product, which is beneficial for applications with limited space constraints.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions into a single chip, reducing complexity, power consumption, and cost of the product.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, enhancing the efficiency and performance of the product.

Terminal Form: BALL

Ball terminals provide a reliable and secure connection, ensuring better signal transmission and overall performance of the product.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V is ideal for providing stable power to the product, enabling consistent and reliable operation.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for a higher density of connections on the PCB, saving space and enabling more complex electronic designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z030-2SBG485I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B485

Length:

19 mm

No. of Terminals:

485

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA485,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.44 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

XC7Z030-2SBG485I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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