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TMS320DM6446AZWTA

Texas Instruments

TMS320DM6446AZWTA by Texas Instruments

TMS320DM6446AZWTA by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for industrial applications, it features I2C, SPI, UART, USB compatibility and operates in temperatures ranging from -40 to 105°C.

Median Price

$51.406

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 47 parts In-Stock

1+ parts

$48.830

100+ parts

$44.580

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-

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47

$48.830

$44.580

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Arrow

USA . 29 parts In-Stock

1+ parts

$51.110

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-

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29

$51.110

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Texas Instruments

USA . 1,470 parts In-Stock

1+ parts

$51.406

100+ parts

$45.695

1k+ parts

$33.599

10k+ parts

-

1,470

$51.406

$45.695

$33.599

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Mouser Electronics

USA . 93 parts In-Stock

1+ parts

$80.060

100+ parts

$60.370

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-

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93

$80.060

$60.370

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Rochester

USA . 2,696 parts In-Stock

1+ parts

-

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$48.300

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$43.210

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$40.670

2,696

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$48.300

$43.210

$40.670

DigiKey

USA . 2,696 parts In-Stock

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2,696

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Verical

USA . 2,362 parts In-Stock

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-

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$60.375

1k+ parts

$54.013

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$50.837

2,362

-

$60.375

$54.013

$50.837

Avnet

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$55.994

1k+ parts

$50.251

10k+ parts

-

1

-

$55.994

$50.251

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,694 parts In-Stock

1+ parts

$44.336

100+ parts

-

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1,694

$44.336

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DigiKey Marketplace

USA . 2,835 parts In-Stock

1+ parts

$48.540

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2,835

$48.540

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Nova Conductors

Japan . 300 parts In-Stock

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$53.890

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300

$53.890

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Vyrian

USA . 8,000 parts In-Stock

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8,000

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Chip Stock

USA . 625 parts In-Stock

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625

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North Shore Components

USA . 50 parts In-Stock

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50

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Euro-Tech

UK . 20 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 94 parts In-Stock

1+ parts

$13.234

100+ parts

-

1k+ parts

$13.739

10k+ parts

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94

$13.234

-

$13.739

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DigiPath Technology Company

USA . 473 parts In-Stock

1+ parts

$14.573

100+ parts

$13.407

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473

$14.573

$13.407

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ChromeModa Solutions

Germany . 5,980 parts In-Stock

1+ parts

$14.870

100+ parts

$12.193

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-

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5,980

$14.870

$12.193

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IDEA Electronic Components Group

UK . 1,497 parts In-Stock

1+ parts

$14.870

100+ parts

$14.126

1k+ parts

$13.383

10k+ parts

-

1,497

$14.870

$14.126

$13.383

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Semicontronic

India . 1,199 parts In-Stock

1+ parts

$39.670

100+ parts

$38.678

1k+ parts

$38.480

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1,199

$39.670

$38.678

$38.480

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Ampacity Inc.

Singapore . 1,070 parts In-Stock

1+ parts

$39.670

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-

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1,070

$39.670

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Corphita

USA . 2,890 parts In-Stock

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$42.003

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2,890

$42.003

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$44.868

100+ parts

$40.830

1k+ parts

$36.792

10k+ parts

-

2,500

$44.868

$40.830

$36.792

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Corohmni

South Africa . 2,734 parts In-Stock

1+ parts

$49.990

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2,734

$49.990

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Continental Prestige Electronics

USA . 4,177 parts In-Stock

1+ parts

$53.890

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$52.812

4,177

$53.890

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$52.812

Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$53.890

100+ parts

$51.196

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-

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$47.962

40

$53.890

$51.196

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$47.962

Microchip USA

USA . 5,118 parts In-Stock

1+ parts

$114.471

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$114.471

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Argo Parts USA

USA . 1,955 parts In-Stock

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1,955

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Perfect Parts

USA . 1,744 parts In-Stock

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1,744

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A-Z Elektronik GmbH

Germany . 450 parts In-Stock

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450

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Cyclops Electronics Ltd (Excess)

UK . 106 parts In-Stock

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106

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Overview

Unlock the power of cutting-edge technology with the TMS320DM6446AZWTA by Texas Instruments. Renowned for their superior quality and innovation, Texas Instruments delivers a versatile solution in the category of Other Function uPs,uCs & Peripheral ICs. This product offers unparalleled value with its wide range of applications and benefits, making it the ideal choice for customers seeking reliable performance and advanced functionality. Upgrade your projects with the TMS320DM6446AZWTA and experience the future of technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and enabling automated manufacturing processes.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product more energy-efficient.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, optimizing layout and design of the overall system.

Bit Size: 32

With a 32-bit architecture, the product offers higher computational accuracy and performance compared to lower bit sizes, suitable for complex computing tasks.

Power Supplies (V): 1.2, 1.8, 3.3

Supporting multiple power supply voltages provides flexibility for different system requirements, ensuring compatibility with various components and peripherals.

No. of Terminals: 361

Having a high number of terminals allows for versatile connectivity options, enabling integration with a wide range of external devices and interfaces.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles enhances thermal dissipation, signal integrity, and space-saving capabilities for optimized system performance.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even under low power conditions, enhancing the product's stability and efficiency.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended usage without compromising performance.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to function in extreme cold environments, making it suitable for industrial applications with varying temperature conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easier PCB mounting and soldering processes, streamlining assembly and maintenance tasks.

Maximum Seated Height: 1.4 mm

The low maximum seated height minimizes the overall profile of the package, reducing space constraints and allowing for compact system designs.

RAM Words: 16384

With a large RAM capacity of 16,384 words, the product can efficiently store and process data, enabling smooth operation of memory-intensive applications.

Width: 16 mm

The compact width of 16 mm allows for efficient utilization of board space, contributing to a clutter-free and optimized system layout.

External Data Bus Width: 48

Featuring a wide external data bus width of 48 bits enhances data transfer speed and bandwidth, improving overall system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds ensures reliable soldering processes and prevents overheating during assembly, maintaining product integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables efficient soldering of the package onto the PCB, ensuring strong and durable connections for long-term reliability.

Length: 16 mm

The compact length of 16 mm complements the width and height dimensions, enabling a space-efficient and integrated placement within the system architecture.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the product meets stringent performance and reliability standards, making it suitable for robust and demanding environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type enhances processing capabilities and connectivity options, allowing for versatile integration with external devices and systems.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high speed, and excellent noise immunity, making the product efficient, fast, and reliable for various computing tasks.

Terminal Form: BALL

The ball terminal form offers superior mechanical and electrical connections, ensuring secure attachment to the PCB and reliable signal transmission for stable operation.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V provides a stable and standardized power input for consistent performance and compatibility with other components in the system.

Bus Compatibility: I2C; SPI; UART; USB

Supporting multiple bus protocols such as I2C, SPI, UART, and USB enhances connectivity options and interoperability with various devices, enabling seamless data communication and control.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8 mm, the product offers high-density mounting capability, allowing for more terminals in a limited space and enabling compact system designs.

Format: FIXED POINT

The fixed-point format facilitates efficient arithmetic and computational operations, ensuring precision and accuracy in processing data for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the product can withstand moderate exposure to moisture during handling and assembly processes, ensuring product reliability and longevity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6446AZWTA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

48

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6446AZWTA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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