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XCZU11EG-1FFVB1517E

Xilinx

XCZU11EG-1FFVB1517E by Xilinx

XCZU11EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.

Median Price

$4,437.340

Lifecycle Status

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 846 parts In-Stock

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$6.428

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Ampacity Inc.

Singapore . 1,064 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 1,354 parts In-Stock

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$15.600

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$15.520

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$27.275

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$25.912

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Modulus Dynamics

Lithuania . 1,552 parts In-Stock

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MARBEL Systems

Belgium . 40 parts In-Stock

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Corohmni

South Africa . 5,149 parts In-Stock

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Texas Native Microelectronics

USA . 15 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,961 parts In-Stock

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Kenton Components

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Netroflash

USA . 2,000 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Qasali Group International

UK . 2,634 parts In-Stock

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Supply Digital

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Vigor

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Corphita

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Overview

Unleash the power of cutting-edge technology with the XCZU11EG-1FFVB1517E by Xilinx. As a trusted manufacturer in the industry, Xilinx delivers top-quality Other Function uPs, uCs & Peripheral ICs designed to elevate your projects to new heights. Whether you're working on automotive applications, industrial automation, or telecommunications, this product offers unparalleled value, benefits, and advantages to ensure optimal performance and reliability. Stay ahead of the curve with Xilinx and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to external elements, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.876 V

Provides a reliable power input range for the product, ensuring stable performance under varying conditions.

Package Shape: RECTANGULAR

Facilitates compact and organized arrangement on the circuit board, optimizing space usage and improving overall aesthetics.

No. of Terminals: 1517

Offers extensive connectivity options for various external components, enhancing the functionality and versatility of the product.

Package Style (Meter): GRID ARRAY

Provides a uniform and structured layout of terminals, simplifying the connection process and minimizing errors during installation.

Minimum Supply Voltage: 0.825 V

Ensures compatibility with a wide range of power sources, allowing the product to operate efficiently in different environments.

Maximum Operating Temperature: 100 °C

Guarantees reliable performance even under high temperature conditions, making the product suitable for demanding applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides enhanced electrical conductivity and corrosion resistance, ensuring long-term reliability and stability of connections.

Terminal Position: BOTTOM

Facilitates easy access and connection to external components, simplifying the installation process and reducing the risk of errors.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures efficient assembly during the manufacturing process, reducing production time and costs.

Peak Reflow Temperature °C: 245

Allows for secure soldering of components, ensuring strong and durable connections that can withstand thermal stress.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Enables advanced processing capabilities and functionality, making the product suitable for complex applications requiring high computational power.

Technology: CMOS

Provides low power consumption and high noise immunity, contributing to improved efficiency and reliability of the product.

Terminal Form: BALL

Facilitates reliable and secure connections, ensuring stable performance and signal integrity during operation.

Nominal Supply Voltage: 0.85 V

Optimizes power usage and efficiency, enhancing the overall performance and longevity of the product.

Moisture Sensitivity Level (MSL): 4

Indicates the level of protection against moisture damage, ensuring the product's reliability and durability in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-1FFVB1517E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU11EG-1FFVB1517E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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