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XCZU4EV-3FBVB900E

Xilinx

XCZU4EV-3FBVB900E by Xilinx

Xilinx XCZU4EV-3FBVB900E is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.873-0.927 V. Ideal for applications requiring high-performance computing in compact form factors.

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Vyrian

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AZTECH Wire

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Aztec Data Supply Inc.

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MARBEL Systems

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One Stop Electronics

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Advanced Electronics

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Overview

Unleash the power of cutting-edge technology with the XCZU4EV-3FBVB900E by Xilinx. This top-tier manufacturer offers exceptional quality in the category of Other Function uPs, uCs & Peripheral ICs, making it a game-changer for various applications. Elevate your projects with this high-performance product that provides unmatched value, benefits, and advantages to customers. Experience innovation like never before with Xilinx's XCZU4EV-3FBVB900E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product ideal for applications where weight and durability are important factors.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing overall product size.

Maximum Supply Voltage: 0.927 V

The high maximum supply voltage allows for reliable and stable operation even under varying input voltage conditions.

Package Shape: RECTANGULAR

The rectangular shape makes the product easy to integrate into existing PCB layouts and designs.

No. of Terminals: 900

Having a high number of terminals allows for multiple connections and functionalities, making the product versatile in various applications.

Package Style (Meter): GRID ARRAY

Grid array packaging offers better thermal performance and electrical characteristics, improving overall product reliability and longevity.

Minimum Supply Voltage: 0.873 V

The low minimum supply voltage ensures energy efficiency and helps prevent overheating issues in the product.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and operate reliably in demanding applications.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish provides good conductivity and reliability, ensuring stable electrical connections for optimal performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB assembly and maintenance, making the product more user-friendly and easier to integrate.

Peak Reflow Temperature: 245C

With a high peak reflow temperature, the product can withstand the soldering process without compromising its performance or integrity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit enhances the product's processing capabilities and enables advanced functionalities for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage ensures stable and efficient operation, maintaining optimal performance levels throughout the product's lifespan.

Moisture Sensitivity Level (MSL): 4

With a low moisture sensitivity level, the product is less prone to moisture-related damage, ensuring long-term reliability in various operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4EV-3FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.927 V

Minimum Supply Voltage:

.873 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4EV-3FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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