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XCZU3CG-1SFVC784E

Xilinx

XCZU3CG-1SFVC784E by Xilinx

XCZU3CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.

Median Price

$490.575

Lifecycle Status

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7

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Newark

USA . 5 parts In-Stock

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$477.430

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Mouser Electronics

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Digiode

USA . 176 parts In-Stock

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VNN

France . 529 parts In-Stock

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$482.250

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Nova Conductors

Japan . 300 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 574 parts In-Stock

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$16.738

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Corohmni

South Africa . 2,652 parts In-Stock

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Modulus Dynamics

Lithuania . 1,255 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,348 parts In-Stock

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MARBEL Systems

Belgium . 124 parts In-Stock

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Texas Native Microelectronics

USA . 77 parts In-Stock

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Kenton Components

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Vigor

Singapore . 497 parts In-Stock

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Semicontronic

India . 57 parts In-Stock

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$409.910

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$399.662

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Ampacity Inc.

Singapore . 48 parts In-Stock

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Corphita

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Argo Parts USA

USA . 4,503 parts In-Stock

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$472.629

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Continental Prestige Electronics

USA . 2,944 parts In-Stock

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Advanced Electronics

New Zealand . 88 parts In-Stock

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Microchip USA

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Qasali Group International

UK . 433 parts In-Stock

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Netroflash

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Overview

Unlock limitless possibilities with the XCZU3CG-1SFVC784E by Xilinx, a cutting-edge microprocessor circuit that boasts unparalleled quality and reliability. From its innovative CMOS technology to its versatile package style, this device is designed to exceed your expectations in performance and efficiency. Whether you're looking to enhance your IoT devices or streamline your industrial processes, the XCZU3CG-1SFVC784E offers unmatched value and benefits that will propel your projects to new heights. Trust Xilinx, a leader in semiconductor manufacturing, to deliver a solution that empowers you to innovate with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The material is lightweight and durable, making the product suitable for portable and rugged applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, reducing manufacturing time and costs.

Package Shape: SQUARE

Square packages are easier to handle and store compared to irregular shapes, improving overall manufacturability.

No. of Terminals: 784

Having a high number of terminals allows for greater connectivity options and functionality in the product.

Package Style (Meter): GRID ARRAY

Grid array packages offer better heat dissipation and signal integrity, resulting in improved performance and reliability.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, the product can withstand harsh environments without performance degradation.

Minimum Operating Temperature: 0 °C

The wide operating temperature range ensures the product can function reliably in various temperature conditions.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish provides excellent solderability and corrosion resistance, enhancing the overall longevity of the product.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuits offer high processing power and flexibility, making the product suitable for demanding computing tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, improving efficiency and reliability.

Terminal Form: BALL

Ball terminals provide excellent electrical conductivity and mechanical strength, ensuring reliable connections in the product.

Nominal Supply Voltage: 0.85 V

The low nominal supply voltage helps in reducing power consumption and heat generation, enhancing energy efficiency.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that the product can withstand exposure to moisture during storage and assembly processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU3CG-1SFVC784E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU3CG-1SFVC784E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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