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MCIMX6L8DVN10AA

NXP Semiconductors

MCIMX6L8DVN10AA by NXP Semiconductors

MCIMX6L8DVN10AA by NXP Semiconductors is a 432-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage range of 1.375-1.5V. Ideal for applications requiring thin profile and fine pitch grid array packages.

Median Price

$22.092

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

MCIMX6L8DVN10AA by NXP Semiconductors
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 685 parts In-Stock

1+ parts

$13.140

100+ parts

-

1k+ parts

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685

$13.140

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Rochester

USA . 158 parts In-Stock

1+ parts

-

100+ parts

$21.370

1k+ parts

$19.120

10k+ parts

$17.990

158

-

$21.370

$19.120

$17.990

Farnell

UK . 158 parts In-Stock

1+ parts

-

100+ parts

$22.815

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-

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158

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$22.815

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DigiKey

USA . 97 parts In-Stock

1+ parts

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100+ parts

$28.110

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97

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$28.110

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Distributors (In-Stock)

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Digiode

USA . 4,622 parts In-Stock

1+ parts

$12.160

100+ parts

-

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4,622

$12.160

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$19.683

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500

$19.683

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Anansix

USA . 580 parts In-Stock

1+ parts

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580

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Cyclops Electronics Ltd

UK . 165 parts In-Stock

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165

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Vyrian

USA . 73 parts In-Stock

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73

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Prism Electronics

USA . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 334 parts In-Stock

1+ parts

$10.880

100+ parts

-

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334

$10.880

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Semicontronic

India . 90 parts In-Stock

1+ parts

$10.880

100+ parts

$10.608

1k+ parts

$10.554

10k+ parts

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90

$10.880

$10.608

$10.554

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Corphita

USA . 4,045 parts In-Stock

1+ parts

$11.520

100+ parts

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4,045

$11.520

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Component Stockers USA

USA . 1,091 parts In-Stock

1+ parts

$15.660

100+ parts

$15.660

1k+ parts

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10k+ parts

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1,091

$15.660

$15.660

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Continental Prestige Electronics

USA . 2,133 parts In-Stock

1+ parts

$19.683

100+ parts

-

1k+ parts

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10k+ parts

$19.289

2,133

$19.683

-

-

$19.289

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$21.988

100+ parts

$20.889

1k+ parts

$20.889

10k+ parts

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3,000

$21.988

$20.889

$20.889

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Aztec Data Supply Inc.

USA . 116 parts In-Stock

1+ parts

$33.003

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116

$33.003

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Microchip USA

USA . 2,089 parts In-Stock

1+ parts

$48.510

100+ parts

$47.660

1k+ parts

$47.240

10k+ parts

$46.820

2,089

$48.510

$47.660

$47.240

$46.820

Corohmni

South Africa . 262 parts In-Stock

1+ parts

$58.696

100+ parts

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262

$58.696

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A-Z Elektronik GmbH

Germany . 7,358 parts In-Stock

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7,358

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Argo Parts USA

USA . 2,094 parts In-Stock

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2,094

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$19.289

1k+ parts

$18.698

10k+ parts

$18.305

2,000

-

$19.289

$18.698

$18.305

UNI Independent Distributors

Spain . 1,791 parts In-Stock

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1,791

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Perfect Parts

USA . 109 parts In-Stock

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109

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Overview

Experience unparalleled performance and reliability with the MCIMX6L8DVN10AA by NXP Semiconductors. As a trusted industry leader, NXP Semiconductors is known for delivering cutting-edge solutions in the category of Other Function uPs, uCs & Peripheral ICs. This innovative product offers customers a seamless integration experience, high-quality materials, and superior functionality. From maximizing efficiency in industrial applications to enhancing connectivity in smart devices, the MCIMX6L8DVN10AA ensures that your projects run smoothly and efficiently. Trust NXP Semiconductors to provide you with the best technology solutions for all your needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protects the internal components of the product.

Surface Mount:

YES - Allows for easy installation and maintenance, making it suitable for production processes.

Maximum Supply Voltage:

1.5 V - Provides a wide voltage range for compatibility with various power sources.

Package Shape:

SQUARE - This shape allows for efficient use of space and easier integration into circuit designs.

No. of Terminals:

432 - Offers a high number of connection points for versatile applications.

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH - This style enables compact and precise placement on circuit boards.

Minimum Supply Voltage:

1.375 V - Ensures stable performance even with lower voltage inputs.

Maximum Operating Temperature:

95 °C - Can withstand high temperatures, suitable for demanding operating environments.

Minimum Operating Temperature:

0 °C - Can operate effectively in low-temperature conditions.

Terminal Finish:

TIN SILVER COPPER - Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position:

BOTTOM - Facilitates easy connection with other components in a circuit.

Maximum Seated Height:

1.1 mm - Low profile design for space-saving installations.

Width:

13 mm - Compact size for efficient use of board space.

Maximum Time At Peak Reflow Temperature (s):

40 - Allows for quick and effective soldering during assembly processes.

Peak Reflow Temperature °C:

260 - Withstands high temperatures during soldering without affecting performance.

Length:

13 mm - Compact size for versatile applications.

Peripheral IC Type:

SoC - Integrated functions for simplified circuit design and reduced components.

Technology:

CMOS - Offers low power consumption and high noise immunity for efficient operation.

Terminal Form:

BALL - Provides reliable connections with other components.

Terminal Pitch:

0.5 mm - Fine pitch for precise placement on circuit boards.

Moisture Sensitivity Level (MSL):

3 - Suitable for environments with moderate humidity levels.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6L8DVN10AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B432

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

432

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA432,24X24,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.375 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

13 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6L8DVN10AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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