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XC7Z035-1FFG676C

Xilinx

XC7Z035-1FFG676C by Xilinx

The Xilinx XC7Z035-1FFG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

Median Price

$1,476.020

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 410 parts In-Stock

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$1,410.750

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Nova Conductors

Japan . 500 parts In-Stock

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$1,476.020

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VNN

France . 311 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 196 parts In-Stock

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$15.631

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Aztec Data Supply Inc.

USA . 4,957 parts In-Stock

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$24.640

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Corohmni

South Africa . 48 parts In-Stock

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$70.901

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Modulus Dynamics

Lithuania . 1,017 parts In-Stock

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$74.033

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$74.033

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$74.033

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Texas Native Microelectronics

USA . 90 parts In-Stock

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$117.616

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$112.911

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$109.383

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$103.502

90

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$103.502

One Stop Electronics

USA . 4 parts In-Stock

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$1,262.250

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Ampacity Inc.

Singapore . 4 parts In-Stock

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Semicontronic

India . 4 parts In-Stock

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$1,262.250

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$1,230.694

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$1,224.382

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Corphita

USA . 379 parts In-Stock

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$1,336.500

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Argo Parts USA

USA . 3,026 parts In-Stock

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$1,476.020

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$1,461.260

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$1,446.500

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$1,431.739

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$1,461.260

$1,446.500

$1,431.739

Continental Prestige Electronics

USA . 1,133 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$1,502.511

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$1,502.511

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Lixinc

USA . 4,574 parts In-Stock

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Kenton Components

USA . 3,528 parts In-Stock

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Qasali Group International

UK . 2,653 parts In-Stock

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MARBEL Systems

Belgium . 2,308 parts In-Stock

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Vigor

Singapore . 533 parts In-Stock

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Supply Digital

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S.R.D Solutions

India . 250 parts In-Stock

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Overview

Unlock the power of innovation with the XC7Z035-1FFG676C by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that exceed expectations. This versatile System on Chip offers endless possibilities for applications in various fields, providing customers with unparalleled performance and reliability. Experience the value and benefits of this cutting-edge technology, revolutionizing the way you approach your projects. Discover the advantages that the XC7Z035-1FFG676C can bring to your next endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on PCBs, saving time and space.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage ensures reliable performance under varying power conditions.

Package Shape: SQUARE

The square shape is compact and allows for efficient use of space on the PCB.

No. of Terminals: 676

With a high number of terminals, this product can accommodate a wide range of connections and functionalities.

Package Style (Meter): GRID ARRAY

The grid array package style provides a high level of connectivity and reliability for the integrated circuits.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures energy efficiency and reliable operation even at lower power levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to be used in a variety of environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in cold environments without any issues.

Terminal Position: BOTTOM

The bottom terminal position allows for easy and efficient PCB layout and connections.

Maximum Seated Height: 3.24 mm

The low maximum seated height is beneficial for slim and compact device designs.

Width: 27 mm

The compact width of the product allows for space-efficient PCB design and integration.

Length: 27 mm

The square shape with equal length and width contributes to a symmetrical and aesthetically pleasing design.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions into a single chip, reducing the need for external components and improving overall system efficiency.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-powered devices and reliable operation.

Terminal Form: BALL

The ball terminal form provides reliable and secure connections, ensuring stable performance and easy assembly.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V is suitable for a wide range of applications and power requirements.

Terminal Pitch: 1 mm

The small terminal pitch allows for high-density packaging and efficient use of PCB space, enabling complex circuit designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z035-1FFG676C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

3.24 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z035-1FFG676C Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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