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XCZU4EV-1SFVC784I

Xilinx

XCZU4EV-1SFVC784I by Xilinx

XCZU4EV-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$1,760.330

Lifecycle Status

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DigiKey

USA . 6 parts In-Stock

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Digiode

USA . 295 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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VNN

France . 620 parts In-Stock

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Vyrian

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Sensible Micro Corp

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Chip Stock

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Touchstone Systems

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AZTECH Wire

Italy . 302 parts In-Stock

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Corohmni

South Africa . 308 parts In-Stock

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Aztec Data Supply Inc.

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MARBEL Systems

Belgium . 7,016 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 3,816 parts In-Stock

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$55.541

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$48.876

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Modulus Dynamics

Lithuania . 527 parts In-Stock

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$77.822

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Qasali Group International

UK . 4,317 parts In-Stock

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$124.967

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$109.971

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Microchip USA

USA . 3,169 parts In-Stock

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$1,211.304

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One Stop Electronics

USA . 2 parts In-Stock

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$1,360.130

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Ampacity Inc.

Singapore . 2 parts In-Stock

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Semicontronic

India . 2 parts In-Stock

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$1,326.127

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$1,319.326

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Corphita

USA . 473 parts In-Stock

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Argo Parts USA

USA . 4,061 parts In-Stock

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$1,498.989

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$1,483.847

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Continental Prestige Electronics

USA . 3,287 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Perfect Parts

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Supply Digital

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Vigor

Singapore . 330 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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GreenTree Electronics

Israel . 150 parts In-Stock

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RC Electronics

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Futuretech Components

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Overview

Unlock unlimited possibilities with the XCZU4EV-1SFVC784I by Xilinx. Known for their superior quality and cutting-edge technology, Xilinx delivers top-of-the-line solutions in the category of Other Function uPs,uCs & Peripheral ICs. This versatile microprocessor circuit is perfect for a wide range of applications, providing customers with unmatched performance and reliability. Experience the value and benefits of Xilinx's innovative products today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making it suitable for a variety of applications. It also offers good thermal and electrical insulation properties.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 0.876 V

Having a high maximum supply voltage allows for flexibility in power requirements, making the product suitable for a wide range of electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape enables easy integration into electronic systems and provides a standardized form factor for compatibility with existing designs.

No. of Terminals: 784

With a high number of terminals, this product offers extensive connectivity options, allowing for complex circuit designs and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style provides high density mounting and improved reliability, making it suitable for high-performance applications that require precise connections.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can function reliably even in harsh environmental conditions, ensuring consistent performance in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for a sufficient duration during manufacturing processes, ensuring proper soldering and assembly without compromising component integrity.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC allows for advanced computing capabilities and increased processing power, making the product suitable for demanding applications that require complex functions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4EV-1SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4EV-1SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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