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XCZU7EG-2FFVF1517I

Xilinx

XCZU7EG-2FFVF1517I by Xilinx

XCZU7EG-2FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

Median Price

$4,980.652

Lifecycle Status

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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One Stop Electronics

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AZTECH Wire

Italy . 640 parts In-Stock

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Semicontronic

India . 1,321 parts In-Stock

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Ampacity Inc.

Singapore . 1,103 parts In-Stock

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Aztec Data Supply Inc.

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MARBEL Systems

Belgium . 300 parts In-Stock

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Corohmni

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 303 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Qasali Group International

UK . 1,930 parts In-Stock

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Supply Digital

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Overview

Unleash the power of cutting-edge technology with the XCZU7EG-2FFVF1517I by Xilinx. As a trusted industry leader, Xilinx delivers top-quality products that push the boundaries of innovation. Designed for a wide range of applications, this microprocessor circuit offers unparalleled performance and reliability. With advanced features and industrial-grade durability, customers can trust in the value and benefits that this product brings to their projects. Upgrade your technology solutions today with the XCZU7EG-2FFVF1517I from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the product.

Surface Mount: YES

Surface mount packaging allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 876 mV

The high maximum supply voltage allows for flexibility in power input options, accommodating a wider range of applications.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to integrate into various electronic devices.

No. of Terminals: 1517

With a high number of terminals, this product can support complex circuit designs and provide advanced functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient routing of connections and minimizes signal interference, optimizing performance.

Minimum Supply Voltage: 825 mV

The low minimum supply voltage helps reduce power consumption, making the product more energy efficient.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions, increasing reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in a wide range of temperature settings, enhancing versatility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper terminal finish provides a reliable and conductive interface for connectivity.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and assembly onto circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering of the product during assembly, preventing connection issues.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures secure solder joints and long-lasting connections.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates high reliability and performance in demanding industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integration of microprocessor circuitry provides advanced processing capabilities and enhances the product's functionality.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product efficient and responsive.

Terminal Form: BALL

Ball terminal form facilitates easy connections and soldering, improving the overall reliability of the product.

Nominal Supply Voltage: 850 mV

The specified nominal supply voltage ensures stable and consistent power delivery, enhancing performance.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates a moderate level of moisture sensitivity, suitable for standard manufacturing processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EG-2FFVF1517I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EG-2FFVF1517I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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