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XCZU4CG-1FBVB900I

Xilinx

XCZU4CG-1FBVB900I by Xilinx

XCZU4CG-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

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Overview

Discover the power and reliability of the XCZU4CG-1FBVB900I by Xilinx, a cutting-edge solution in the realm of microprocessor circuits. With Xilinx's proven track record of excellence, this industrial-grade peripheral IC offers unparalleled performance and versatility. From advanced automation systems to high-speed data processing, this product is designed to meet the demands of a wide range of applications. Experience the value and benefits of state-of-the-art technology with the XCZU4CG-1FBVB900I, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and assembly time.

Maximum Supply Voltage: 0.876 V

Higher maximum supply voltage provides flexibility and compatibility with various power sources.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to handle and place in standard mounting configurations.

No. of Terminals: 900

Large number of terminals allow for multiple connections, enhancing functionality and versatility.

Package Style (Meter): GRID ARRAY

Grid array package style facilitates efficient heat dissipation and signal routing, promoting stable performance.

Minimum Operating Temperature: -40 °C

Wide temperature range enables reliable operation in harsh environments or extreme conditions.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates resistance to moisture absorption, ensuring long-term usability in humid or damp conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4CG-1FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4CG-1FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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