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XCZU7EV-1FFVC1156I

Xilinx

XCZU7EV-1FFVC1156I by Xilinx

XCZU7EV-1FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$4,438.690

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Newark

USA . 5 parts In-Stock

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Digiode

USA . 325 parts In-Stock

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$3,797.663

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VNN

France . 911 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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Vyrian

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Corohmni

South Africa . 923 parts In-Stock

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$15.016

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AZTECH Wire

Italy . 276 parts In-Stock

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MARBEL Systems

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$43.095

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Texas Native Microelectronics

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$51.599

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Kenton Components

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$61.919

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Modulus Dynamics

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Qasali Group International

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Microchip USA

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One Stop Electronics

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Semicontronic

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$3,295.973

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Corphita

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Argo Parts USA

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$3,966.078

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$3,926.017

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$3,885.956

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Netroflash

USA . 500 parts In-Stock

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Supply Digital

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Overview

Unlock the limitless potential of your electronic designs with the XCZU7EV-1FFVC1156I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers cutting-edge technology that guarantees top-notch quality and reliability. This versatile microprocessor circuit is perfect for a wide range of applications, offering unmatched performance and efficiency. Experience seamless integration, unparalleled functionality, and superior results with this innovative product. Elevate your projects to new heights with the XCZU7EV-1FFVC1156I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to various environmental conditions, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes, saving time and resources.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing its versatility.

Package Shape: RECTANGULAR

The rectangular shape of the package offers a compact design, saving space and enabling more efficient PCB layouts.

No. of Terminals: 1156

Having a high number of terminals allows for connectivity to a wide range of components, making this product suitable for complex applications.

Package Style: GRID ARRAY

The grid array package style provides a high level of connectivity and stability, ensuring a secure connection for optimal performance.

Minimum Supply Voltage: 0.825 V

With a low minimum supply voltage, this product is energy-efficient and can operate effectively even in low-power situations.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range ensures the product can perform reliably in various environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions, making this product suitable for a wide range of applications.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish provides a reliable and conductive connection, ensuring optimal performance and longevity of the product.

Terminal Position: BOTTOM

With terminals positioned at the bottom, installation and maintenance of the product are simplified, making it user-friendly.

Maximum Time At Peak Reflow Temperature: 30s

This short reflow time reduces the risk of thermal damage during assembly, increasing the reliability of the product.

Peak Reflow Temperature: 245C

The high peak reflow temperature allows for effective soldering, ensuring strong and stable connections for the product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh operating conditions, making it suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

With a microprocessor circuit, this product offers advanced processing capabilities, making it ideal for complex and demanding tasks.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high performance, making this product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form offers a secure connection and ease of installation, ensuring a reliable performance of the product.

Nominal Supply Voltage: 0.85 V

With a stable nominal supply voltage, this product offers consistent and reliable operation in various conditions.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that this product is resistant to moisture damage, ensuring durability and longevity in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EV-1FFVC1156I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EV-1FFVC1156I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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