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TCI6630K2LCMSA

Texas Instruments

TCI6630K2LCMSA by Texas Instruments

TCI6630K2LCMSA by Texas Instruments is a CMOS microprocessor circuit with 900 ball terminals in a grid array package. It operates b/w 0.902V to 0.997V, making it suitable for high-performance applications requiring low supply voltage. Ideal for advanced electronic systems demanding efficient processing power in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,975 parts In-Stock

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Digiode

USA . 2,993 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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PC Components Company LLC

USA . 1 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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One Stop Electronics

USA . 420 parts In-Stock

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$3.000

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420

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AZTECH Wire

Italy . 522 parts In-Stock

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$14.448

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Parana Technologies

USA . 2,037 parts In-Stock

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$24.934

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$25.630

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$25.630

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DigiPath Technology Company

USA . 590 parts In-Stock

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$27.456

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$25.259

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590

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Ampacity Inc.

Singapore . 185 parts In-Stock

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$28.000

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$28.000

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ChromeModa Solutions

Germany . 2,826 parts In-Stock

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$28.016

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$22.973

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IDEA Electronic Components Group

UK . 511 parts In-Stock

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$28.016

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$26.615

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$25.214

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511

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Corohmni

South Africa . 362 parts In-Stock

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$61.372

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Continental Prestige Electronics

USA . 3,667 parts In-Stock

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Argo Parts USA

USA . 3,555 parts In-Stock

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Corphita

USA . 1,502 parts In-Stock

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Bastille Electronics

Australia . 74 parts In-Stock

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Overview

Experience the superior quality and unmatched performance of the TCI6630K2LCMSA by Texas Instruments, a leading manufacturer in the industry. This cutting-edge microprocessor circuit offers endless possibilities in various applications, from automotive to industrial sectors. With its advanced technology and reliable design, this product provides exceptional value and benefits to customers looking for top-of-the-line solutions. Trust Texas Instruments to deliver excellence with the TCI6630K2LCMSA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to heat, making this product suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, reducing overall production cost and time.

Maximum Supply Voltage: 0.997 V

The high maximum supply voltage tolerance allows for flexibility in power supply design and operational reliability.

Package Shape: SQUARE

The square package shape is convenient for space-saving layout designs and makes it easier to mount the chip onto the PCB.

No. of Terminals: 900

Having a high number of terminals enables this product to accommodate complex circuit designs and connections, increasing versatility.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and signal integrity, improving overall product efficiency.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage requirement allows for energy-efficient operation and extends the product's battery life.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and soldering process, making it more convenient for production and maintenance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers high processing power and capabilities, making it suitable for advanced electronic applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast operation, making this product efficient and reliable for various applications.

Terminal Form: BALL

Using ball terminal form simplifies the mounting and connection processes, enhancing the product's reliability and ease of use.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage specification ensures stable and consistent operation of the product within the specified voltage range, ensuring reliable performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LCMSA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

TCI6630K2LCMSA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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