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TCI6630K2LSCMSA

Texas Instruments

TCI6630K2LSCMSA by Texas Instruments

TCI6630K2LSCMSA by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,875 parts In-Stock

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8,875

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Digiode

USA . 3,053 parts In-Stock

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3,053

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 683 parts In-Stock

1+ parts

$8.425

100+ parts

-

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683

$8.425

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Ampacity Inc.

Singapore . 595 parts In-Stock

1+ parts

$18.000

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-

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595

$18.000

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Parana Technologies

USA . 1,003 parts In-Stock

1+ parts

$25.407

100+ parts

-

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$26.032

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1,003

$25.407

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$26.032

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DigiPath Technology Company

USA . 222 parts In-Stock

1+ parts

$27.976

100+ parts

$25.738

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222

$27.976

$25.738

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ChromeModa Solutions

Germany . 6,436 parts In-Stock

1+ parts

$28.547

100+ parts

$23.409

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6,436

$28.547

$23.409

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IDEA Electronic Components Group

UK . 469 parts In-Stock

1+ parts

$28.547

100+ parts

$27.120

1k+ parts

$25.692

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469

$28.547

$27.120

$25.692

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One Stop Electronics

USA . 1,608 parts In-Stock

1+ parts

$33.000

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1,608

$33.000

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Corohmni

South Africa . 848 parts In-Stock

1+ parts

$74.583

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848

$74.583

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Continental Prestige Electronics

USA . 6,094 parts In-Stock

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6,094

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Argo Parts USA

USA . 3,767 parts In-Stock

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3,767

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Corphita

USA . 2,445 parts In-Stock

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2,445

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Experience the power of cutting-edge technology with the TCI6630K2LSCMSA by Texas Instruments. Crafted with precision and expertise, this microprocessor circuit offers unparalleled performance and reliability. Ideal for a variety of applications, this innovative product provides seamless integration and enhanced functionality. Unlock the potential of your projects with the TCI6630K2LSCMSA and discover a new level of efficiency and convenience. Elevate your experience with Texas Instruments – where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 0.997 V

The high maximum supply voltage allows for flexibility in power input options and compatibility with various power sources.

Package Shape: SQUARE

The square package shape helps optimize PCB layout and space utilization, making it easier to integrate into designs.

No. of Terminals: 900

The high number of terminals provides ample connectivity options, allowing for versatile and complex circuit designs.

Package Style (Meter): GRID ARRAY

The grid array package style offers high terminal density in a compact form factor, maximizing component placement efficiency.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage allows for efficient power consumption and operation at lower power levels, suitable for energy-efficient systems.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish ensures good electrical conductivity and reliable connections for optimal performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and mounting on the PCB, simplifying assembly and maintenance processes.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature minimizes the risk of heat damage during soldering, ensuring component integrity and reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for robust solder joints and thermal stability, ensuring long-term durability in various operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced processing capabilities and versatile functionality, suitable for a wide range of applications.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and reliable performance, making the product efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form simplifies installation and rework processes, improving assembly efficiency and reducing production time.

Nominal Supply Voltage: 0.95 V

The stable nominal supply voltage ensures consistent and reliable operation of the product, contributing to overall system performance and longevity.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates the product's ability to withstand moderate moisture exposure, ensuring reliability in diverse environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LSCMSA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TCI6630K2LSCMSA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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