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TCI6630K2LCMSA24

Texas Instruments

TCI6630K2LCMSA24 by Texas Instruments

TCI6630K2LCMSA24 by Texas Instruments is a CMOS microprocessor circuit with 900 ball terminals in a grid array package. It operates b/w 0.902V to 0.997V, making it suitable for high-performance applications requiring low power consumption and advanced processing capabilities. Ideal for use in various electronic devices where space-saving and efficient computing solutions are essential.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,601 parts In-Stock

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5,601

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Digiode

USA . 4,050 parts In-Stock

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4,050

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Distributors (Availability)

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One Stop Electronics

USA . 910 parts In-Stock

1+ parts

$5.000

100+ parts

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910

$5.000

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AZTECH Wire

Italy . 433 parts In-Stock

1+ parts

$9.308

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433

$9.308

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Corohmni

South Africa . 200 parts In-Stock

1+ parts

$47.544

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200

$47.544

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Parana Technologies

USA . 1,040 parts In-Stock

1+ parts

$60.340

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1,040

$60.340

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DigiPath Technology Company

USA . 371 parts In-Stock

1+ parts

$66.442

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371

$66.442

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ChromeModa Solutions

Germany . 6,917 parts In-Stock

1+ parts

$67.798

100+ parts

$55.594

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6,917

$67.798

$55.594

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IDEA Electronic Components Group

UK . 1,565 parts In-Stock

1+ parts

$67.798

100+ parts

$64.408

1k+ parts

$61.018

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1,565

$67.798

$64.408

$61.018

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Corphita

USA . 1,510 parts In-Stock

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1,510

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Overview

Unleash the power of cutting-edge technology with the TCI6630K2LCMSA24 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in their products, including this versatile microprocessor circuit. Ideal for a wide range of applications, this product offers unparalleled value and benefits to customers seeking high-performance solutions. Elevate your projects with the TCI6630K2LCMSA24 and experience the advantages of Texas Instruments' expertise in innovation and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection and insulation for the components inside the package, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 0.997 V

With a higher maximum supply voltage, the product can handle a wider range of power inputs, making it versatile in different applications.

Package Shape: SQUARE

A square package shape can provide efficient use of space on a circuit board, allowing for compact and streamlined designs.

No. of Terminals: 900

Having a large number of terminals allows for the connection of numerous components and peripherals, enabling complex functions and capabilities.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and connectivity, facilitating easier interfacing with other components and peripherals.

Minimum Supply Voltage: 0.902 V

A lower minimum supply voltage ensures efficient power usage and compatibility with lower power sources, improving energy efficiency.

Terminal Position: BOTTOM

Bottom terminal position can provide ease of soldering and connection, enhancing the assembly process and overall reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product can offer advanced processing capabilities, enabling complex calculations and operations in electronic systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product suitable for various power-sensitive applications.

Terminal Form: BALL

A ball terminal form allows for reliable connections and heat dissipation, enhancing the product's overall performance and longevity.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage of 0.95 V indicates a stable and standard operating voltage, ensuring compatibility with a wide range of electronic systems and components.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LCMSA24 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

TCI6630K2LCMSA24 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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