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TCI6630K2LXCMS

Texas Instruments

TCI6630K2LXCMS by Texas Instruments

TCI6630K2LXCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,406 parts In-Stock

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2,406

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Vyrian

USA . 2,124 parts In-Stock

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2,124

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Distributors (Availability)

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One Stop Electronics

USA . 1,011 parts In-Stock

1+ parts

$3.000

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1,011

$3.000

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AZTECH Wire

Italy . 836 parts In-Stock

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$8.487

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836

$8.487

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Ampacity Inc.

Singapore . 1,403 parts In-Stock

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$16.000

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$16.000

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Parana Technologies

USA . 871 parts In-Stock

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$19.060

100+ parts

$1,770.032

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$17.154

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871

$19.060

$1,770.032

$17.154

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DigiPath Technology Company

USA . 382 parts In-Stock

1+ parts

$20.988

100+ parts

$19.309

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382

$20.988

$19.309

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ChromeModa Solutions

Germany . 3,128 parts In-Stock

1+ parts

$21.416

100+ parts

$17.561

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3,128

$21.416

$17.561

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IDEA Electronic Components Group

UK . 1,917 parts In-Stock

1+ parts

$21.416

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$20.345

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$19.274

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1,917

$21.416

$20.345

$19.274

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Corohmni

South Africa . 169 parts In-Stock

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$62.143

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169

$62.143

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Continental Prestige Electronics

USA . 5,667 parts In-Stock

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Argo Parts USA

USA . 3,321 parts In-Stock

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Corphita

USA . 2,738 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Overview

Unleash the power of innovation with the TCI6630K2LXCMS by Texas Instruments, a cutting-edge microprocessor circuit designed to revolutionize your electronic projects. Crafted with precision and expertise by one of the most trusted names in the industry, this versatile component offers endless possibilities for applications in various fields. Whether you're a seasoned professional or an aspiring DIY enthusiast, this product's advanced technology, reliability, and top-notch performance will exceed your expectations. Embrace the future of technology and unlock new horizons with the TCI6630K2LXCMS - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and resistance to heat and moisture, ensuring the product's reliability in various environments.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 0.997 V

The high maximum supply voltage allows for flexibility in power input, accommodating a range of electrical systems.

Package Shape: SQUARE

The square shape can help in optimizing space on the PCB and enables a more compact design.

No. of Terminals: 900

Having a large number of terminals provides extensive connectivity options, allowing for versatile applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced thermal performance and electrical characteristics, contributing to the product's overall efficiency.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the product suitable for various usage scenarios.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring stable electrical connections over time.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier PCB layout and improves overall system airflow for better cooling.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time helps in preventing damage to sensitive components during the assembly process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures proper soldering and component bonding, leading to robust and reliable connections.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced computing capabilities and processing power for sophisticated applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form provides better mechanical strength and solder joint reliability compared to other forms, ensuring long-term performance.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage is well-balanced, offering stability in operation without excessive power consumption.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 means the product is suitable for standard factory assembly processes and storage conditions, reducing the risk of moisture-related damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LXCMS attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TCI6630K2LXCMS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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