Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EFR32MG21A010F768IM32-B by Silicon Labs is a surface mount system on chip (SoC) with 32 terminals. It operates at a voltage range of 1.71V to 3.8V and can withstand temperatures from -40°C to 125°C. This automotive-grade IC is suitable for various applications requiring low power consumption and compact size.
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$36.630
This product can be easily mounted on a PCB, allowing for efficient and space-saving designs.
With a high maximum supply voltage, this product can handle a wide range of power requirements, making it versatile for different applications.
The square package shape offers stability and ease of integration into various electronic systems.
This product has a sufficient number of terminals, enabling it to interface with multiple devices and perform complex functions.
The combination of chip carrier package style, heat sink/slugs, and a very thin profile enables efficient heat dissipation, reducing the risk of overheating.
The low minimum supply voltage requirement allows for operation in low-power environments, making it energy-efficient.
With a high maximum operating temperature, this product can perform reliably in demanding and high-temperature environments.
The wide operating temperature range ensures the product's functionality even in extremely cold conditions.
The matte tin terminal finish provides good solderability and ensures a solid electrical connection.
The quad terminal position enables easy and secure connectivity within a circuit, enhancing the product's robustness.
The ultra-low maximum seated height allows for compact and space-saving designs, especially in slim devices.
The compact width allows for flexibility in design and integration into space-constrained applications.
This product can withstand a maximum time of 40 seconds at the peak reflow temperature, ensuring successful soldering during assembly processes.
With a high peak reflow temperature, this product can withstand higher thermal stresses during soldering, ensuring reliable connections.
The compact length enables convenient integration into tight electronic layouts and devices.
Designed with the automotive industry in mind, this product meets the stringent temperature and performance requirements of automotive applications.
This product features a system-on-chip design, incorporating various peripheral functions into a single integrated circuit, simplifying system complexity and reducing component count.
Based on CMOS technology, this product offers low power consumption and high integration capabilities, making it a reliable and efficient choice.
With a no-lead terminal form, the product eliminates the risk of lead contamination and complies with global environmental regulations, ensuring a safer and greener solution.
The standard nominal supply voltage of 3V allows for compatibility with a wide range of power sources, facilitating easy integration into existing systems.
The terminal pitch of 0.4 mm provides precise and reliable electrical connections, ensuring signal integrity and efficient data transfer.
With an MSL of 2, this product has a moderate moisture sensitivity level, requiring proper handling and storage to prevent damage during the assembly process.
Other Function uPs,uCs & Peripheral ICs EFR32MG21A010F768IM32-B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Silicon Labs
JESD-30 Code:
JESD-609 Code:
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EFR32MG21A010F768IM32-B Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - EFR32xG21 27/Oct/2020 EFR32xG2x/BGx2x0Px/MGM2x0Px 13/Jul/2022
PCN Assembly/Origin - Assembly Site 01/Feb/2023
PCN Packaging - IC/SIP MOQ Chg 11/Jan/2022 Labeling Change 14/Dec/2021
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
DS18B20U+
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Eic Semiconductor
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
Sangdest Microelectronics (Nanjing)
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
SCANSTA112VS/NOPB
National Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC7Z035-1FBG676C
Xilinx
The Xilinx XC7Z035-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 676 terminals in a square grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.
1431
Ndk America
Other uPs/uCs/Peripheral ICs;
FT245BL-T/R
FTDI
FT245BL-T/R by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V. It operates in temperatures from 0°C to 70°C, making it suitable for commercial applications requiring a microprocessor circuit with CMOS technology. The package style is flatpack, low profile, and it features gull wing terminal form for easy surface mounting at a compact size of 7mm x 7mm.
MFRC52201HN1,118
NXP Semiconductors
The NXP Semiconductors MFRC52201HN1,118 is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE CHIP CARRIER package. It operates at -25 to 85 °C and requires 3/3.3V power supply. Ideal for applications requiring contactless communication such as RFID systems and access control devices.
MCP25050T-E/SL
Microchip Technology
MCP25050T-E/SL by Microchip: 8-bit peripheral IC with 5V supply, -40 to 125°C operating temp. Ideal for automotive applications, TS16949 certified, small outline package with dual terminals.
ST33HTPH2X32AHD5
STMicroelectronics
ST33HTPH2X32AHD5 by STMicroelectronics is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105°C, has a terminal pitch of 0.5mm, and requires a nominal voltage of 1.8V. Ideal for secure applications requiring compact design in surface-mount configurations.
88E1111-BAB
Marvell Technology
M1A3P600L-1FGG144I
SoC; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
XC7Z035-L2FBG676I
The Xilinx XC7Z035-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.
MIMXRT1064CVL5A
The NXP MIMXRT1064CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.
EFR32MG24B220F1536IM48-B
Silicon Labs
EFR32MG24B220F1536IM48-B by Silicon Labs is a SoC with CMOS technology. It operates b/w -40 to 125°C, with supply voltage range of 1.71V to 3.8V. With 48 terminals in a square package, it's ideal for IoT and wireless applications due to its low profile and high temperature tolerance.
AM6254ATCGGAALW
Texas Instruments
AM6254ATCGGAALW by Texas Instruments is a SoC peripheral IC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-speed processing and low power consumption.
MSP430F6779IPEU
MSP430F6779IPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at a max frequency of 25 MHz. Ideal for industrial applications, it features ROM of 524288 words and RAM of 32 words. With a supply voltage range of 1.8-3.6 V, this CMOS technology-based IC supports I2C, SPI, and UART bus compatibility.
MCIMX535DVV1C
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
ATECC508A-MAHDA-S
Microchip ATECC508A-MAHDA-S is a cryptographic authenticator IC with 8 terminals, TS 16949 screening, and 2-5.5V supply range. Ideal for secure applications, it operates b/w -40 to 85°C and features a small outline package with nickel palladium gold finish.
ASI4UE-G1-SR-7
Zentrum Mikroelektronik Dresden Ag
MCIMX535DVV1CR2
MCIMX535DVV1CR2 by NXP Semiconductors is a SYSTEM ON CHIP with 529 terminals, operating at -20 to 85 °C. It has a supply voltage range of 0.9/1.25-1.3 V and uses BALL terminal form for various applications in Other Function uPs,uCs & Peripheral ICs.
AM6231ASGGGAALW
AM6231ASGGGAALW by Texas Instruments is a 425-terminal SoC IC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. This very thin profile, fine pitch grid array package is ideal for applications requiring high-speed processing in compact spaces.
MCIMX31CVMN4D
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
EFR32BG22C112F352GM32-C
SoC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 2;
EFR32MG21A020F1024IM32-B
EFR32MG21A020F1024IM32-B by Silicon Labs is a 32-terminal, CMOS System on Chip with a supply voltage range of 1.71V to 3.8V. Ideal for automotive applications, it operates b/w -40°C to 125°C and features a compact square package style with matte tin finish for surface mount assembly.
EFR32MG21A020F512IM32-B
EFR32MG21A020F512IM32-B by Silicon Labs is a 32-terminal, square-shaped chip carrier with a supply voltage range of 1.71V to 3.8V. Operating b/w -40°C to 125°C, it's an automotive-grade System on Chip (SoC) suitable for various IoT applications due to its CMOS technology and compact dimensions of 4mm x 4mm.
EFR32MG21A020F768IM32-B
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
EFR32MG21A010F512IM32-B
EFR32MG21A010F1024IM32-B
EFR32MG21A010F1024IM32-B by Silicon Labs is a 32-terminal, square-shaped chip carrier with a supply voltage range of 1.71V to 3.8V. Operating b/w -40°C to 125°C, it's an automotive-grade System on Chip (SoC) with CMOS technology ideal for various peripheral applications.
SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Minimum Supply Voltage: 1.71 V;
EFR32MG24B010F1536IM40-B
SoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;
EFR32MG24B210F1536IM48-B
SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Operating Temperature: 125 Cel;
EFR32MG24A010F1536IM48-B
SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Package Body Material: UNSPECIFIED;
EFR32MG24B020F1536IM40-B
SoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;
EFR32MG24B310F1536IM48-B
EFR32MG24B310F1536IM48-B by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
EFR32MG12P432F1024IM48-CR
EFR32MG12P432F1024IM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating at temperatures from -40 to 125°C. It has a supply voltage range of 1.8V to 3.8V and utilizes CMOS technology. This chip is ideal for applications requiring low-profile, surface-mount components in various electronic systems.
EFR32MG24A021F1024IM40-B
EFR32MG24A021F1024IM40-B by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
EFR32BG24B210F1024IM48-B
SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .4 mm;
EFR32MG24B120F1536IM48-B
SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
EFR32MG24A010F1536IM40-B
EFR32MG24A010F1536IM40-B by Silicon Labs is a SoC peripheral IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 125°C, with supply voltage ranging from 1.71V to 3.8V. Ideal for applications requiring low-profile and high-temperature performance like IoT devices and wearables.
EFR32MG12P432F1024GM48-CR
EFR32MG12P432F1024GM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.8V to 3.8V and utilizes CMOS technology. This chip carrier with a very thin profile is suitable for various applications requiring low power consumption and compact design.
EFR32MG12P432F1024IM48-C
SYSTEM ON CHIP;
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