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CC1312R1F3RGZR

Texas Instruments

CC1312R1F3RGZR by Texas Instruments

CC1312R1F3RGZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 81920 RAM Bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring low power consumption and high processing capabilities.

Median Price

$6.510

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,720 parts In-Stock

1+ parts

$4.324

100+ parts

$3.525

1k+ parts

$2.350

10k+ parts

-

13,720

$4.324

$3.525

$2.350

-

Mouser Electronics

USA . 717 parts In-Stock

1+ parts

$6.510

100+ parts

$4.520

1k+ parts

$4.050

10k+ parts

$3.930

717

$6.510

$4.520

$4.050

$3.930

DigiKey

USA . 2,934 parts In-Stock

1+ parts

$6.540

100+ parts

$4.946

1k+ parts

$4.352

10k+ parts

-

2,934

$6.540

$4.946

$4.352

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 992 parts In-Stock

1+ parts

$4.108

100+ parts

-

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-

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992

$4.108

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$5.262

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150

$5.262

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Chip Stock

USA . 18,500 parts In-Stock

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18,500

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Cyclops Electronics Ltd

UK . 17,500 parts In-Stock

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17,500

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Vyrian

USA . 8,639 parts In-Stock

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8,639

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Sensible Micro Corp

USA . 700 parts In-Stock

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,009 parts In-Stock

1+ parts

$3.680

100+ parts

$3.588

1k+ parts

$3.570

10k+ parts

-

7,009

$3.680

$3.588

$3.570

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Ampacity Inc.

Singapore . 6,670 parts In-Stock

1+ parts

$3.680

100+ parts

-

1k+ parts

-

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6,670

$3.680

-

-

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Corphita

USA . 3,445 parts In-Stock

1+ parts

$3.892

100+ parts

-

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10k+ parts

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3,445

$3.892

-

-

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Continental Prestige Electronics

USA . 6,142 parts In-Stock

1+ parts

$5.262

100+ parts

-

1k+ parts

-

10k+ parts

$5.157

6,142

$5.262

-

-

$5.157

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$5.367

100+ parts

$5.367

1k+ parts

$5.367

10k+ parts

-

100

$5.367

$5.367

$5.367

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Parana Technologies

USA . 2,284 parts In-Stock

1+ parts

$14.935

100+ parts

-

1k+ parts

$15.358

10k+ parts

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2,284

$14.935

-

$15.358

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DigiPath Technology Company

USA . 1,087 parts In-Stock

1+ parts

$16.445

100+ parts

-

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1,087

$16.445

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ChromeModa Solutions

Germany . 5,409 parts In-Stock

1+ parts

$16.781

100+ parts

$13.760

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-

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5,409

$16.781

$13.760

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IDEA Electronic Components Group

UK . 174 parts In-Stock

1+ parts

$16.781

100+ parts

$15.942

1k+ parts

$15.103

10k+ parts

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174

$16.781

$15.942

$15.103

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Microchip USA

USA . 927 parts In-Stock

1+ parts

$31.091

100+ parts

-

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927

$31.091

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Corohmni

South Africa . 769 parts In-Stock

1+ parts

$35.017

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769

$35.017

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GreenTree Electronics

Israel . 80,000 parts In-Stock

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80,000

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Speed Components Ltd (Excess)

Israel . 52,500 parts In-Stock

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52,500

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A-Z Elektronik GmbH

Germany . 12,500 parts In-Stock

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12,500

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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iodParts Technologies Inc.

India . 5,290 parts In-Stock

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5,290

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Lixinc

USA . 4,765 parts In-Stock

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4,765

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Argo Parts USA

USA . 3,115 parts In-Stock

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3,115

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

-

-

-

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Benley Electronics

USA . 528 parts In-Stock

1+ parts

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528

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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350

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Lucentia Tech

USA . 350 parts In-Stock

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350

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Overview

Unlock the full potential of your electronic devices with the CC1312R1F3RGZR by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions in the field of microprocessor circuits. This versatile chip carrier offers a wide range of applications, from smart home devices to industrial automation. With a nominal supply voltage of 3V and an impressive 81920 bytes of RAM, this very thin profile package provides unmatched performance and efficiency. Invest in the CC1312R1F3RGZR today and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packaging provides good protection for the components inside, ensuring durability and longevity for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.8 V

A higher maximum supply voltage allows for more flexibility in power supply options, making the product suitable for a variety of applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, maximizing the functionality of the product in a compact design.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the product to function effectively in extreme temperature environments, ensuring reliable performance in various conditions.

RAM Bytes: 81920

With a large RAM capacity of 81920 bytes, the product can handle complex data processing tasks efficiently and effectively, making it a versatile solution for a wide range of applications.

Technology: CMOS

CMOS technology enables low power consumption and high-speed operation, making the product energy-efficient and suitable for battery-powered devices or applications requiring fast processing.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC1312R1F3RGZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DIMENSION CONSIDER BASED ON LINKHTTP://WWW.TI.COM/LIT/DS/SYMLINK/CC1312R.PDF

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

81920

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CC1312R1F3RGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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