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MCIMX7D2DVM12SD

NXP Semiconductors

MCIMX7D2DVM12SD by NXP Semiconductors

MCIMX7D2DVM12SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.2-1.25 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.

Median Price

$35.600

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4 parts In-Stock

1+ parts

$35.600

100+ parts

$24.410

1k+ parts

$23.920

10k+ parts

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4

$35.600

$24.410

$23.920

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Verical

USA . 4 parts In-Stock

1+ parts

$35.600

100+ parts

$24.410

1k+ parts

$23.920

10k+ parts

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4

$35.600

$24.410

$23.920

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DigiKey

USA . 84 parts In-Stock

1+ parts

$40.530

100+ parts

$31.136

1k+ parts

$27.912

10k+ parts

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84

$40.530

$31.136

$27.912

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EBV Elektronik

Germany . 504 parts In-Stock

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504

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Rochester

USA . 20 parts In-Stock

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$24.160

1k+ parts

$21.620

10k+ parts

$20.340

20

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$24.160

$21.620

$20.340

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 69 parts In-Stock

1+ parts

$16.100

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69

$16.100

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Nova Conductors

Japan . 25 parts In-Stock

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$31.520

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25

$31.520

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Digiode

USA . 348 parts In-Stock

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$34.266

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348

$34.266

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Vyrian

USA . 4,919 parts In-Stock

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4,919

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Anansix

USA . 1,948 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,006 parts In-Stock

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Chip Stock

USA . 629 parts In-Stock

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TME

Poland . 504 parts In-Stock

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$32.650

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504

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$32.650

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Resion

USA . 55 parts In-Stock

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55

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Distributors (Availability)

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iBuyXS LLC

. 20,000 parts In-Stock

1+ parts

$15.000

100+ parts

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$15.000

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AZTECH Wire

Italy . 718 parts In-Stock

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$17.019

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718

$17.019

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Aztec Data Supply Inc.

USA . 969 parts In-Stock

1+ parts

$26.080

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969

$26.080

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Continental Prestige Electronics

USA . 866 parts In-Stock

1+ parts

$26.920

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$26.382

866

$26.920

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$26.382

Corohmni

South Africa . 586 parts In-Stock

1+ parts

$27.990

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586

$27.990

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$28.830

100+ parts

$27.388

1k+ parts

$27.388

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2,000

$28.830

$27.388

$27.388

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Ampacity Inc.

Singapore . 114 parts In-Stock

1+ parts

$30.660

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114

$30.660

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Semicontronic

India . 114 parts In-Stock

1+ parts

$30.660

100+ parts

$29.894

1k+ parts

$29.740

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114

$30.660

$29.894

$29.740

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$30.890

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$29.654

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$30.890

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$29.654

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Corphita

USA . 3,255 parts In-Stock

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$32.463

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$32.463

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Microchip USA

USA . 1,762 parts In-Stock

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$86.296

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iodParts Technologies Inc.

India . 40,000 parts In-Stock

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GlobX GmbH

Germany . 29,000 parts In-Stock

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BidChips

USA . 20,000 parts In-Stock

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Lixinc

USA . 10,288 parts In-Stock

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UNI Independent Distributors

Spain . 5,839 parts In-Stock

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Robosynatics

Brazil . 2,128 parts In-Stock

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Lucentia Tech

USA . 2,128 parts In-Stock

1+ parts

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$27.430

1k+ parts

$26.870

10k+ parts

$26.870

2,128

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$27.430

$26.870

$26.870

Futuretech Components

Singapore . 840 parts In-Stock

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840

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Argo Parts USA

USA . 612 parts In-Stock

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612

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Perfect Parts

USA . 94 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the MCIMX7D2DVM12SD by NXP Semiconductors. Designed for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category, this innovative product offers unparalleled quality and reliability. With a package style of GRID ARRAY, LOW PROFILE, FINE PITCH, and a minimal supply voltage of 1.2 V, customers can expect top-notch performance in a compact design. Experience seamless integration and optimal functionality with this advanced system on chip solution. Upgrade your projects today with the MCIMX7D2DVM12SD and unleash limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight package for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.25 V

Ensures safe operation within specified voltage limits.

Package Shape: SQUARE

Simplifies the design and layout of the circuit board.

No. of Terminals: 541

Offers a high level of connectivity for various functions.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables a compact and efficient layout on the circuit board.

Minimum Supply Voltage: 1.2 V

Ensures stable operation even at low supply voltages.

Maximum Operating Temperature: 85 °C

Allows for reliable performance in a wide range of operating conditions.

Minimum Operating Temperature: 0 °C

Ensures the product can operate in cold environments.

Terminal Position: BOTTOM

Facilitates easy connection to the circuit board.

Maximum Seated Height: 1.42 mm

Allows for a low-profile design.

Width: 19 mm

Provides a compact form factor for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for efficient and accurate soldering during assembly.

Peak Reflow Temperature °C: 260

Ensures proper soldering for reliable connections.

Length: 19 mm

Offers a balanced form factor for various applications.

Peripheral IC Type: SYSTEM ON CHIP

Integrates multiple functions into a single chip for enhanced performance.

Technology: CMOS

Provides low power consumption and high noise immunity.

Terminal Form: BALL

Facilitates easy installation and removal from the circuit board.

Nominal Supply Voltage: 1.225 V

Optimizes performance at the specified voltage level.

Terminal Pitch: 0.75 mm

Enables high-density packaging on the circuit board.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX7D2DVM12SD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B541

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

541

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA541,25X25,29

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.42 mm

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.225 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX7D2DVM12SD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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