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TCI6630K2LCMS

Texas Instruments

TCI6630K2LCMS by Texas Instruments

TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,274 parts In-Stock

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Digiode

USA . 3,855 parts In-Stock

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3,855

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 653 parts In-Stock

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$10.611

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653

$10.611

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Ampacity Inc.

Singapore . 1,441 parts In-Stock

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$14.000

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$14.000

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Parana Technologies

USA . 792 parts In-Stock

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$19.600

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$19.596

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792

$19.600

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$19.596

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DigiPath Technology Company

USA . 1,415 parts In-Stock

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$21.583

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$19.856

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1,415

$21.583

$19.856

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ChromeModa Solutions

Germany . 2,676 parts In-Stock

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$22.023

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$18.059

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2,676

$22.023

$18.059

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IDEA Electronic Components Group

UK . 1,543 parts In-Stock

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$22.023

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$20.922

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$19.821

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1,543

$22.023

$20.922

$19.821

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One Stop Electronics

USA . 793 parts In-Stock

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$26.000

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793

$26.000

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Corohmni

South Africa . 1,126 parts In-Stock

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$63.398

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$63.398

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Continental Prestige Electronics

USA . 6,195 parts In-Stock

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Argo Parts USA

USA . 2,303 parts In-Stock

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Corphita

USA . 1,119 parts In-Stock

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1,119

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Experience the next level of efficiency and performance with the TCI6630K2LCMS by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments delivers a product that exceeds expectations in the category of Other Function uPs,uCs & Peripheral ICs. With its advanced features and reliable design, this product offers unparalleled value to customers across various industries. Elevate your projects with the TCI6630K2LCMS and unlock endless possibilities for innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, making it a good choice for portable applications.

Surface Mount: YES

The surface mount capability allows for easy installation and reduces the overall size of the product, making it a good choice for space-constrained designs.

Maximum Supply Voltage: 0.997 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing its versatility in different voltage applications.

Package Shape: SQUARE

The square package shape provides a compact design, allowing for efficient use of PCB space and making it a good choice for dense electronic assemblies.

No. of Terminals: 900

The large number of terminals allows for complex connections and functionality, making this product suitable for advanced electronic systems.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced thermal and electrical performance, making it a good choice for high-power applications.

Minimum Supply Voltage: 0.902 V

The low minimum supply voltage ensures efficient operation at lower power inputs, making this product suitable for energy-efficient designs.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance in various environments.

Terminal Position: BOTTOM

With terminals located at the bottom, this product allows for easy connections and better thermal management, enhancing overall functionality.

Maximum Time at Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of component damage during soldering, increasing the product's reliability.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance enables the product to withstand intense soldering processes, making it suitable for demanding manufacturing environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit, this product offers advanced processing capabilities, making it ideal for applications requiring sophisticated control functions.

Technology: CMOS

Built using CMOS technology, this product delivers low power consumption and high-speed operation, making it a good choice for battery-powered and performance-critical applications.

Terminal Form: BALL

The ball terminal form provides reliable connections and improved solder joint strength, ensuring long-term durability of the product.

Nominal Supply Voltage: 0.95 V

With a stable nominal supply voltage, this product maintains consistent performance under varying load conditions, enhancing overall reliability.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that this product can withstand moderate humidity levels, making it suitable for use in various environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LCMS attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TCI6630K2LCMS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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