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TCI6630K2LDCMSA

Texas Instruments

TCI6630K2LDCMSA by Texas Instruments

Texas Instruments TCI6630K2LDCMSA is a CMOS MICROPROCESSOR CIRCUIT with 900 BALL terminals in a GRID ARRAY package. It operates b/w 0.902V to 0.997V, with a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,823 parts In-Stock

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Digiode

USA . 3,978 parts In-Stock

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Nova Conductors

Japan . 95 parts In-Stock

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AZTECH Wire

Italy . 367 parts In-Stock

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$5.443

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One Stop Electronics

USA . 541 parts In-Stock

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$8.000

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541

$8.000

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Ampacity Inc.

Singapore . 1,179 parts In-Stock

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$9.000

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Parana Technologies

USA . 831 parts In-Stock

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$18.242

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$18.377

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831

$18.242

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$18.377

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ChromeModa Solutions

Germany . 1,349 parts In-Stock

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$20.497

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$16.808

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$20.497

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IDEA Electronic Components Group

UK . 639 parts In-Stock

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$20.497

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$19.472

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$18.447

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639

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Corohmni

South Africa . 420 parts In-Stock

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$35.046

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Continental Prestige Electronics

USA . 6,957 parts In-Stock

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Argo Parts USA

USA . 3,654 parts In-Stock

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DigiPath Technology Company

USA . 969 parts In-Stock

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$18.480

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Corphita

USA . 637 parts In-Stock

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Bastille Electronics

Australia . 33 parts In-Stock

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Overview

Unleash the power of innovation with the TCI6630K2LDCMSA by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality and reliability in every product. The TCI6630K2LDCMSA falls into the category of Other Function uPs, uCs & Peripheral ICs, offering versatile applications in various industries. With 900 terminals and advanced CMOS technology, this microprocessor circuit delivers unmatched performance and efficiency. Elevate your projects with the TCI6630K2LDCMSA, providing value, benefits, and advantages that exceed expectations. Choose Texas Instruments for cutting-edge solutions that drive progress.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and protection for the integrated circuits inside the package.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly processes.

Maximum Supply Voltage: 0.997 V

Operating within a safe maximum supply voltage range ensures the longevity and reliability of the product.

Package Shape: SQUARE

Square packages are easier to handle and mount on PCBs compared to irregular shapes.

No. of Terminals: 900

Having a large number of terminals allows for more connectivity options and functionality in the circuit design.

Package Style (Meter): GRID ARRAY

Grid array package style provides a high terminal count in a compact space, ideal for densely populated PCB designs.

Minimum Supply Voltage: 0.902 V

The minimum supply voltage ensures that the product can still operate reliably even under low power conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and routing of connections.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, the product is less prone to thermal damage during assembly processes.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures proper soldering and bonding of the terminals during assembly.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a microprocessor circuit as the peripheral IC type provides advanced processing capabilities for the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for various applications.

Terminal Form: BALL

The ball terminal form facilitates reliable connections and ease of soldering during assembly.

Nominal Supply Voltage: 0.95 V

The nominal supply voltage ensures stable and optimal performance of the product under normal operating conditions.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product is moderately sensitive to moisture, requiring proper handling and storage to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TCI6630K2LDCMSA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.997 V

Minimum Supply Voltage:

.902 V

Nominal Supply Voltage:

.95 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TCI6630K2LDCMSA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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