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LS1046AXE8Q1A

NXP Semiconductors

LS1046AXE8Q1A by NXP Semiconductors

LS1046AXE8Q1A by NXP Semiconductors is a 780-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring high performance in a compact form factor.

Median Price

$147.510

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,009 parts In-Stock

1+ parts

$147.510

100+ parts

$111.130

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$147.510

$111.130

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Verical

USA . 1,009 parts In-Stock

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$147.510

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$111.130

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$147.510

$111.130

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Mouser Electronics

USA . 38 parts In-Stock

1+ parts

$160.940

100+ parts

$124.230

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38

$160.940

$124.230

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Rochester

USA . 135 parts In-Stock

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$103.040

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$92.190

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$86.770

135

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$103.040

$92.190

$86.770

Flip Electronics (Authorized)

USA . 1 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,822 parts In-Stock

1+ parts

$108.756

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2,822

$108.756

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Nova Conductors

Japan . 500 parts In-Stock

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$136.830

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500

$136.830

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Vyrian

USA . 7,273 parts In-Stock

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Anansix

USA . 820 parts In-Stock

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820

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TME

Poland . 120 parts In-Stock

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$151.918

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$151.918

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Flip Electronics

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 492 parts In-Stock

1+ parts

$8.973

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492

$8.973

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Aztec Data Supply Inc.

USA . 2,162 parts In-Stock

1+ parts

$66.200

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$66.200

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Corohmni

South Africa . 867 parts In-Stock

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$72.097

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867

$72.097

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Semicontronic

India . 192 parts In-Stock

1+ parts

$97.310

100+ parts

$94.877

1k+ parts

$94.391

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192

$97.310

$94.877

$94.391

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Corphita

USA . 575 parts In-Stock

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$103.032

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575

$103.032

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Microchip USA

USA . 2,597 parts In-Stock

1+ parts

$128.140

100+ parts

$124.720

1k+ parts

$123.010

10k+ parts

$121.300

2,597

$128.140

$124.720

$123.010

$121.300

Continental Prestige Electronics

USA . 4,571 parts In-Stock

1+ parts

$136.830

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$134.093

4,571

$136.830

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$134.093

Netroflash

USA . 100 parts In-Stock

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$136.830

100+ parts

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$129.988

10k+ parts

$127.252

100

$136.830

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$129.988

$127.252

Vigor

Singapore . 1,265 parts In-Stock

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$164.260

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1,265

$164.260

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Ampacity Inc.

Singapore . 192 parts In-Stock

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$211.790

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192

$211.790

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Argo Parts USA

USA . 2,709 parts In-Stock

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UNI Independent Distributors

Spain . 340 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the LS1046AXE8Q1A by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers cutting-edge solutions for various applications in the Other Function uPs, uCs & Peripheral ICs category. With a package style of grid array, fine pitch and a terminal finish of tin silver copper, this product offers unmatched value and benefits to customers. Trust NXP to provide top-notch quality and innovation for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making it suitable for a wide range of operating temperatures.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving space and reducing overall product size.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage ensures stable operation under varying load conditions.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates easy alignment during assembly.

No. of Terminals: 780

The high number of terminals allows for versatile connectivity options and integration with a wide range of external devices.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style enables high-density mounting and precise positioning of the IC on the PCB.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures efficient power consumption and reliable performance even under low voltage conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable operation in harsh environments or high-temperature applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can function even in extremely cold conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and enables efficient heat dissipation during operation.

Maximum Seated Height: 2.61 mm

The low seated height allows for compact designs and slim profile applications where space is limited.

Width: 23 mm

The moderate width provides a good balance between compactness and ease of handling during assembly and maintenance.

Maximum Time At Peak Reflow Temperature (s): 30

The short peak reflow time ensures that the IC is not subjected to excessive heat, minimizing the risk of damage during soldering.

Peak Reflow Temperature °C: 250

The high peak reflow temperature allows for quick and efficient soldering processes, ensuring reliable connections between the IC and the PCB.

Length: 23 mm

The moderate length provides a good balance between compactness and functionality, allowing for versatile mounting options on the PCB.

Peripheral IC Type: SoC

The System-on-Chip (SoC) design integrates multiple functions into a single IC, reducing the need for external components and simplifying system design.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: BALL

The ball terminal form provides reliable connections and facilitates easy rework or replacement of the IC if needed.

Nominal Supply Voltage: 1 V

The nominal supply voltage ensures compatibility with standard power sources, simplifying system integration and power management.

Terminal Pitch: 0.8 mm

The narrow terminal pitch allows for high-density mounting and precise alignment of the IC on the PCB, maximizing space efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL 3 indicates that the IC can withstand exposure to moderate levels of moisture during storage or handling without any adverse effects.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LS1046AXE8Q1A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

780

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA780,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.61 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

SoC

Trade Compliance

LS1046AXE8Q1A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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