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LS1021AXE7HNB

NXP Semiconductors

LS1021AXE7HNB by NXP Semiconductors

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

Median Price

$60.060

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

LS1021AXE7HNB by NXP Semiconductors
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Chip1Stop

Japan . 84 parts In-Stock

1+ parts

$69.300

100+ parts

$50.500

1k+ parts

$43.200

10k+ parts

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84

$69.300

$50.500

$43.200

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Mouser Electronics

USA . 34 parts In-Stock

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$70.100

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$46.260

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34

$70.100

$46.260

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DigiKey

USA . 128 parts In-Stock

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$44.000

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128

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$44.000

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Flip Electronics (Authorized)

USA . 128 parts In-Stock

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128

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Verical

USA . 120 parts In-Stock

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$50.820

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120

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$50.820

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Distributors (In-Stock)

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Digiode

USA . 2,088 parts In-Stock

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$20.995

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2,088

$20.995

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Vyrian

USA . 4,257 parts In-Stock

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Anansix

USA . 2,896 parts In-Stock

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Flip Electronics

USA . 212 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,080 parts In-Stock

1+ parts

$19.890

100+ parts

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2,080

$19.890

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One Stop Electronics

USA . 75 parts In-Stock

1+ parts

$37.400

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75

$37.400

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Corohmni

South Africa . 107 parts In-Stock

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$48.504

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107

$48.504

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Vigor

Singapore . 84 parts In-Stock

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$65.750

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84

$65.750

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Microchip USA

USA . 2,311 parts In-Stock

1+ parts

$111.559

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2,311

$111.559

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UNI Independent Distributors

Spain . 6,400 parts In-Stock

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6,400

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs LS1021AXE7HNB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B525

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

525

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.07 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

LS1021AXE7HNB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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