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LS1023ASN7KQB

NXP Semiconductors

LS1023ASN7KQB by NXP Semiconductors

LS1023ASN7KQB by NXP Semiconductors is a multifunction peripheral IC with CMOS technology. It operates b/w 0-105°C, with supply voltage range of 0.87-0.93V. This square package has 621 terminals in a grid array style, suitable for various uPs and uCs applications.

Median Price

$55.174

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 43 parts In-Stock

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$54.400

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$51.140

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$46.240

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43

$54.400

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$46.240

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Verical

USA . 9,960 parts In-Stock

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$55.949

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Flip Electronics (Authorized)

USA . 273 parts In-Stock

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273

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Digiode

USA . 991 parts In-Stock

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$51.680

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$51.680

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Vyrian

USA . 8,723 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Flip Electronics

USA . 812 parts In-Stock

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Anansix

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Ampacity Inc.

Singapore . 44 parts In-Stock

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$46.240

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44

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Corphita

USA . 2,544 parts In-Stock

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$48.960

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Modulus Dynamics

Lithuania . 3,466 parts In-Stock

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$53.117

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$53.117

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$53.117

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Corohmni

South Africa . 272 parts In-Stock

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$64.740

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Vigor

Singapore . 1,190 parts In-Stock

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$78.050

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Microchip USA

USA . 1,058 parts In-Stock

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$133.446

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Argo Parts USA

USA . 5,093 parts In-Stock

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UNI Independent Distributors

Spain . 1,758 parts In-Stock

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Continental Prestige Electronics

USA . 935 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Elevate your projects to the next level with the LS1023ASN7KQB by NXP Semiconductors. As a leader in semiconductor innovation, NXP ensures top-notch quality and reliability in all their products. This versatile multifunction peripheral IC is packed with features that cater to a wide range of applications, making it a valuable asset for any design. With advanced technology and a user-friendly design, this IC offers unparalleled benefits and advantages to customers looking to elevate their electronics projects. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mounting allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 0.93 V

A high maximum supply voltage ensures stability and reliable performance under varying power conditions.

Package Shape: SQUARE

The square shape is compact and allows for efficient use of space on circuit boards.

No. of Terminals: 621

Having a large number of terminals allows for extensive connectivity options and functionalities.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

This package style enhances thermal performance and allows for high-density mounting, ensuring efficient operation in various applications.

Minimum Supply Voltage: 0.87 V

A low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance even in extreme heat conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function effectively in cold environments.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connections to the circuit board.

Maximum Seated Height: 2.07 mm

The low maximum seated height helps in reducing overall height of the product, making it suitable for compact designs.

Width: 21 mm

The compact width of the product allows for efficient use of space on circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

A short maximum time at peak reflow temperature ensures that the product is not exposed to excessive heat for extended periods, preserving its longevity.

Peak Reflow Temperature °C: 250

The high peak reflow temperature allows for effective soldering and mounting of the product during assembly.

Length: 21 mm

The compact length of the product allows for efficient use of space on circuit boards.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

Being a multifunction peripheral IC, this product offers versatile functionality and can perform multiple tasks, making it a versatile and cost-effective choice.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation, ensuring stable performance.

Nominal Supply Voltage: 0.9 V

The nominal supply voltage ensures optimal performance and compatibility with standard power sources.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and efficient use of space on circuit boards.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product is moderately sensitive to moisture, but can still be handled and stored in normal manufacturing environments without special precautions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LS1023ASN7KQB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B621

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

621

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA621,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.07 mm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

LS1023ASN7KQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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