Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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LS1021ASE7KQB by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 525 terminals in a GRID ARRAY package. It operates b/w 0.97V to 1.03V, suitable for various uPs and uCs applications requiring CMOS technology. The package style includes HEAT SINK/SLUG, with dimensions of 19mm x 19mm and terminal pitch of 0.8mm.
Median Price
$63.180
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10
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1k+
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$38.100
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$35.400
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$30.800
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Arrow
$45.760
DigiKey
$63.730
$47.113
$45.923
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$45.920
Verical
$55.062
Flip Electronics (Authorized)
Digiode
$34.485
Vyrian
$35.800
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Flip Electronics
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$32.670
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$52.345
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$62.840
Microchip USA
$144.509
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Provides good insulation and protection for the internal components, ensuring reliability and durability.
Allows for easy and efficient PCB assembly, saving time and costs in production.
Provides a suitable voltage range for stable operation of the device.
Square shape allows for efficient use of space on the PCB.
High number of terminals allows for versatile connectivity options and functionalities.
Grid array style provides good heat dissipation and thermal management for improved performance.
Wide voltage range allows for flexibility in power input.
Provides good conductivity and corrosion resistance for reliable connections.
Bottom terminal position allows for easier mounting and connection on the PCB.
Low seated height saves space and allows for more compact device designs.
Compact width allows for efficient use of space on the PCB.
40-second reflow time ensures proper soldering and assembly of the device.
High reflow temperature ensures strong and reliable solder joints.
Compact length allows for efficient use of space on the PCB.
Microprocessor circuit provides advanced processing capabilities for the device.
CMOS technology offers low power consumption and high noise immunity for efficient operation.
Ball terminal form allows for reliable connections and ease of soldering on the PCB.
Stable nominal supply voltage ensures consistent and reliable performance.
Fine terminal pitch allows for high-density mounting and compact PCB designs.
MSL 3 indicates that the device has a moderate level of moisture sensitivity, requiring proper handling and storage.
Other Function uPs,uCs & Peripheral ICs LS1021ASE7KQB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
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Package Code:
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Nominal Supply Voltage:
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LS1021ASE7KQB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Mult Dev 25/May/2020 LS1020A/LS1021A/LS1022A 12/Jul/2019
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
EU2B-YS3203C
Idec
ROTARY SWITCH;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
1N4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM2931Z-5.0G
Onsemi
LM2931Z-5.0G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V output voltage, 0.6V dropout voltage, and 0.1A output current. It is ideal for applications requiring stable power supply in temperature-sensitive environments due to its operating range of -40°C to 125°C.
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
LM317T
Linear Technology
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Operating Temperature (TJ-Min): 0 Cel; No. of Functions: 1; JESD-609 Code: e0;
M24308/2-1F
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
Surge Components
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS3203F
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
MKW41Z512VHT4
The NXP Semiconductors MKW41Z512VHT4 is a CMOS microprocessor circuit with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.71 to 3.6 V. Ideal for industrial applications requiring high-performance uPs and uCs in surface-mount configurations.
BGM13S22F512GA-V3R
Silicon Labs
SoC;
MIMX8MN2CVTIZAA
SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e2;
MIMXRT1061CVL5B
NXP Semiconductors' MIMXRT1061CVL5B is a SoC with CMOS technology, featuring 196 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.15-1.26V and peak reflow temp of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
XC7Z020-3CLG484E
Xilinx
The Xilinx XC7Z020-3CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. This low profile chip in a square package is ideal for various applications requiring high performance and integration capabilities.
SCANSTA112VS/NOPB
National Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
6AV2181-8XP00-0AX0
Siemens
Siemens 6AV2181-8XP00-0AX0 is a surface mount rectangular chip with CMOS technology. It operates at temperatures ranging from 0 to 50°C and has a nominal voltage of 3.3V. This microprocessor circuit is commonly used in commercial applications requiring other function uPs, uCs, and peripheral ICs.
CYAT827AZA59-22002
Infineon Technologies
PSoC;
AM6231AKGGHHALW
Texas Instruments
AM6231AKGGHHALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w 0-95°C, with supply voltage ranging from 0.715-0.79V. This square-shaped IC is ideal for applications requiring very thin profile and fine pitch grid array packages.
CY8C3246PVI-147
CY8C3246PVI-147 by Infineon Technologies is an Industrial-grade PSoC with 524288 ROM bits. Operating at 1.8/5V, it features Nickel Palladium Gold finish and MSL of 3. Ideal for applications requiring ultraviolet erasable memory and peak reflow temperature of 260°C within 20s.
MCIMX31CVMN4CR2
Freescale Semiconductor
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE;
ST4SI2M0007AKIFW
ST4SI2M0007AKIFW by STMicroelectronics is a 8-terminal IC with max operating temp of 105°C. It's a small outline, heat sink package used as cryptographic authenticator in various applications. With CMOS technology and no-lead terminals, it's ideal for secure data authentication needs.
XCZU7EG-L1FBVB900I
The Xilinx XCZU7EG-L1FBVB900I is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance processing capabilities.
EFR32BG24A010F1024IM40-BR
EFR32BG24A010F1024IM40-BR by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount ICs in various electronic devices.
ATWINC1500-MR210PB1952
Microchip Technology's ATWINC1500-MR210PB1952 is a CMOS microprocessor circuit with 28 terminals, operating at up to 48 MHz. It has a supply voltage range of 2.7V to 3.6V and can withstand temperatures from -40°C to 80°C. Ideal for industrial applications requiring high clock frequencies in compact designs.
CY8C4024AZI-S413
CY8C4024AZI-S413 by Infineon: 48-terminal PSoC IC with CMOS tech. Operates from -40 to 85°C, voltage range of 1.71-1.89V. Ideal for industrial applications requiring low-profile, fine-pitch packaging.
MPFS250T-1FCSG536I
MPFS250T-1FCSG536I by Microchip Tech is a 536-terminal IC with CMOS tech. Operates b/w -40 to 100°C, with supply voltage range of 0.97V to 1.03V. Ideal for applications requiring low-profile, fine-pitch programmable SoC in a square grid array package.
XCC1312R1F3RGZR
XCC1312R1F3RGZR by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for INDUSTRIAL applications requiring high performance in compact spaces.
USB2660I-JZX-03-TR
USB2660I-JZX-03-TR by Microchip Technology is a 64-terminal chip carrier with a supply voltage range of 3V to 3.6V. It operates in industrial temperatures from -40°C to 85°C, making it suitable for microprocessor circuits. With a max supply current of 275mA, this surface-mount IC is ideal for various applications requiring high-performance peripheral functions.
XCZU3EG-1SFVC784E
XCZU3EG-1SFVC784E by Xilinx is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and processing capabilities.
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LS1021AXN7KQB
LS1021AXN7KQB by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 525 terminals in a GRID ARRAY package. It operates b/w 0.97V to 1.03V, featuring CMOS technology and a peak reflow temperature of 260°C. Ideal for applications requiring high performance and compact design.
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
LS1021ASN7KQB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;
LS1021AXE7KQB
LS1021AXE7KQB by NXP Semiconductors is a microprocessor circuit with a package style of grid array and heat sink/slug. It has a max supply voltage of 1.03V and a min supply voltage of 0.97V. This IC is commonly used in applications requiring high-performance processing capabilities.
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
LS1046AXE8Q1A
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
LS1021ASE7HNB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 2.07 mm;
LS1043AXE8QQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;
LS1043AXE7MQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Terminal Finish: TIN SILVER COPPER;
LS1023ASN7KQB
MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;
LS1023AXE7MQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER; Maximum Operating Temperature: 105 Cel;
LS1023AXE7PQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;
LS1021AXE7HNB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
LS1023AXE7QQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Width: 21 mm;
LS1018A
SYSTEM ON CHIP;
LS1023AXE8PQB
LS1017A
LS1021ASE7KQB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
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