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LS1021ASE7HNB

NXP Semiconductors

LS1021ASE7HNB by NXP Semiconductors

LS1021ASE7HNB by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 525 terminals in a GRID ARRAY package. It operates b/w 0.97V to 1.03V, suitable for various uPs and uCs applications requiring CMOS technology and a terminal pitch of 0.8mm.

Median Price

$42.770

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

LS1021ASE7HNB by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$45.300

100+ parts

$34.200

1k+ parts

$29.300

10k+ parts

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1

$45.300

$34.200

$29.300

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Flip Electronics (Authorized)

USA . 1,111 parts In-Stock

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1,111

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DigiKey

USA . 691 parts In-Stock

1+ parts

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$40.240

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691

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$40.240

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Verical

USA . 660 parts In-Stock

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$46.494

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660

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$46.494

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Rochester

USA . 38 parts In-Stock

1+ parts

-

100+ parts

$37.720

1k+ parts

$33.750

10k+ parts

$31.770

38

-

$37.720

$33.750

$31.770

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 206 parts In-Stock

1+ parts

$39.824

100+ parts

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206

$39.824

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Anansix

USA . 2,851 parts In-Stock

1+ parts

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2,851

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Flip Electronics

USA . 691 parts In-Stock

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691

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Vyrian

USA . 231 parts In-Stock

1+ parts

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231

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 245 parts In-Stock

1+ parts

$35.630

100+ parts

-

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245

$35.630

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Ampacity Inc.

Singapore . 245 parts In-Stock

1+ parts

$35.630

100+ parts

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245

$35.630

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Corphita

USA . 4,966 parts In-Stock

1+ parts

$37.728

100+ parts

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4,966

$37.728

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Aztec Data Supply Inc.

USA . 9,762 parts In-Stock

1+ parts

$45.042

100+ parts

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9,762

$45.042

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Corohmni

South Africa . 479 parts In-Stock

1+ parts

$51.458

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479

$51.458

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Vigor

Singapore . 77 parts In-Stock

1+ parts

$60.140

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77

$60.140

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Semicontronic

India . 37 parts In-Stock

1+ parts

$77.550

100+ parts

$75.611

1k+ parts

$75.224

10k+ parts

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37

$77.550

$75.611

$75.224

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Microchip USA

USA . 1,582 parts In-Stock

1+ parts

$138.300

100+ parts

$135.890

1k+ parts

$134.690

10k+ parts

$133.490

1,582

$138.300

$135.890

$134.690

$133.490

Continental Prestige Electronics

USA . 3,359 parts In-Stock

1+ parts

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3,359

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Argo Parts USA

USA . 2,033 parts In-Stock

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2,033

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UNI Independent Distributors

Spain . 242 parts In-Stock

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242

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Overview

Experience the power and reliability of the LS1021ASE7HNB by NXP Semiconductors, a leading manufacturer in the industry. This cutting-edge microprocessor circuit offers unparalleled performance and versatility for a wide range of applications. With its advanced technology and high-quality construction, this product delivers exceptional value and benefits to customers looking for reliable solutions. Upgrade your electronics with the LS1021ASE7HNB and unleash its full potential in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices or products that may experience rough handling.

Surface Mount: YES

Being surface mountable enhances ease of assembly and allows for efficient use of PCB space, making it suitable for compact electronic designs.

Maximum Supply Voltage: 1.03 V

With a high maximum supply voltage, the product can handle fluctuations in power supply without risk of damage, ensuring reliability and stability in operation.

Package Shape: SQUARE

The square package shape lends itself to a more streamlined and space-efficient PCB layout, making it easier to design circuits and optimize board space.

No. of Terminals: 525

Having a high number of terminals allows for a greater degree of connectivity and functionality, making the product versatile and capable of handling complex circuit configurations.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The use of a grid array package style with a heat sink/slug design helps in dissipating heat efficiently, ensuring optimal thermal management and enhancing overall product performance.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage enables the product to operate effectively even with lower power input, enhancing energy efficiency and expanding compatibility with various power sources.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections and long-term durability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and assembly processes, allowing for easier access and connection to other components on the board.

Maximum Seated Height: 2.07 mm

The low maximum seated height contributes to a compact overall product profile, making it suitable for applications where space constraints are a concern.

Width: 19 mm

The moderate width dimension provides a balance between space efficiency and ease of handling, making the product suitable for various electronic designs.

Maximum Time At Peak Reflow Temperature (s): 40

The specified maximum time at peak reflow temperature ensures that the product can withstand reflow soldering processes without compromising its integrity, facilitating efficient manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable and robust soldering operations, ensuring solid connections and long-term performance under thermal stress.

Length: 19 mm

The moderate length dimension contributes to a balanced form factor, enabling the product to fit well within standard PCB layouts while providing adequate space for component placement.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type offers advanced processing capabilities, making the product suitable for applications requiring high-speed computations and complex functions.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide voltage range, making the product energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

The use of ball terminal form facilitates secure soldering connections and efficient heat dissipation, enhancing the overall reliability and thermal performance of the product.

Nominal Supply Voltage: 1 V

With a stable nominal supply voltage, the product can maintain consistent performance levels and operational reliability, ensuring smooth functionality in diverse electronic systems.

Terminal Pitch: 0.8 mm

The narrow terminal pitch allows for high-density mounting of components on the PCB, enabling space-saving designs and increased functionality within a limited board area.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the product has moderate sensitivity to moisture exposure, requiring standard handling precautions during assembly and storage to prevent potential damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LS1021ASE7HNB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B525

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

525

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.07 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

LS1021ASE7HNB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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