Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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LS1021ASE7HNB by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 525 terminals in a GRID ARRAY package. It operates b/w 0.97V to 1.03V, suitable for various uPs and uCs applications requiring CMOS technology and a terminal pitch of 0.8mm.
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$40.240
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$46.494
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$37.720
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Digiode
$39.824
Anansix
Flip Electronics
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Nova Conductors
One Stop Electronics
$35.630
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Corphita
$37.728
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$45.042
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$51.458
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$60.140
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$77.550
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$138.300
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The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices or products that may experience rough handling.
Being surface mountable enhances ease of assembly and allows for efficient use of PCB space, making it suitable for compact electronic designs.
With a high maximum supply voltage, the product can handle fluctuations in power supply without risk of damage, ensuring reliability and stability in operation.
The square package shape lends itself to a more streamlined and space-efficient PCB layout, making it easier to design circuits and optimize board space.
Having a high number of terminals allows for a greater degree of connectivity and functionality, making the product versatile and capable of handling complex circuit configurations.
The use of a grid array package style with a heat sink/slug design helps in dissipating heat efficiently, ensuring optimal thermal management and enhancing overall product performance.
The low minimum supply voltage enables the product to operate effectively even with lower power input, enhancing energy efficiency and expanding compatibility with various power sources.
The use of tin, silver, and copper terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable electrical connections and long-term durability.
Having terminals positioned at the bottom simplifies PCB layout and assembly processes, allowing for easier access and connection to other components on the board.
The low maximum seated height contributes to a compact overall product profile, making it suitable for applications where space constraints are a concern.
The moderate width dimension provides a balance between space efficiency and ease of handling, making the product suitable for various electronic designs.
The specified maximum time at peak reflow temperature ensures that the product can withstand reflow soldering processes without compromising its integrity, facilitating efficient manufacturing.
The high peak reflow temperature tolerance allows for reliable and robust soldering operations, ensuring solid connections and long-term performance under thermal stress.
The moderate length dimension contributes to a balanced form factor, enabling the product to fit well within standard PCB layouts while providing adequate space for component placement.
Featuring a microprocessor circuit as a peripheral IC type offers advanced processing capabilities, making the product suitable for applications requiring high-speed computations and complex functions.
Utilizing CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide voltage range, making the product energy-efficient and reliable in various operating conditions.
The use of ball terminal form facilitates secure soldering connections and efficient heat dissipation, enhancing the overall reliability and thermal performance of the product.
With a stable nominal supply voltage, the product can maintain consistent performance levels and operational reliability, ensuring smooth functionality in diverse electronic systems.
The narrow terminal pitch allows for high-density mounting of components on the PCB, enabling space-saving designs and increased functionality within a limited board area.
Having a moisture sensitivity level of 3 indicates that the product has moderate sensitivity to moisture exposure, requiring standard handling precautions during assembly and storage to prevent potential damage.
Other Function uPs,uCs & Peripheral ICs LS1021ASE7HNB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
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LS1021ASE7HNB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Mult Dev 25/May/2020 Trace Marking Removal 20/Jun/2019
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Jiangsu Changjiang Electronics Technology
RC0402FR-071KL
Yageo
The Yageo RC0402FR-071KL is a fixed resistor with a resistance of 1000 ohm and a tolerance of 1%. It is suitable for surface mount applications and has a max operating temperature of 155 °C.
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
LL4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Sensitron Semiconductor
RC0603JR-070RL
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Bharat Electronics
CYAT827AZA59-3200A
PSoC;
MCP25050-E/SL
MCP25050-E/SL by Microchip: 8-bit microprocessor circuit with 5V supply, operating from -40 to 125 °C. Automotive grade, TS16949 screened IC in small outline package for surface mount applications. Features dual terminal position, CMOS technology, and matte tin finish on gull wing terminals.
XAZU2EG-L1SFVA625I
Xilinx
Xilinx XAZU2EG-L1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 625 terminals in a GRID ARRAY, FINE PITCH package style. Operating from -40 to 100 °C, it's ideal for industrial applications requiring low power consumption at 0.72 V supply voltage.
EFR32MG24A021F1024IM40-B
Silicon Labs
EFR32MG24A021F1024IM40-B by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
CLRC66301HN,151
NXP Semiconductors
Other uPs/uCs/Peripheral ICs;
1436
Ndk America
P1015NSN5DFB
The NXP Semiconductors P1015NSN5DFB is a 561-terminal SoC IC with CMOS technology. It operates b/w 0-125°C, with supply voltage range of 0.95-1.05 V. This fine-pitch grid array IC is suitable for applications requiring high performance in compact spaces.
SLB9665TT20FW563XUMA3
Infineon's SLB9665TT20FW563XUMA3 is a cryptographic authenticator IC with 28 terminals, operating at -20 to 85 °C. It has a supply voltage range of 3-3.6 V and compact dimensions of 4.4mm x 9.7mm, suitable for secure applications requiring high data protection in small form factors.
5CSEBA2U23A7N
Intel
SoC;
CY8C21434-24LFXIT
Cypress Semiconductor
CY8C21434-24LFXIT by Cypress is a 32-terminal IC with max supply voltage of 5.25V, operating temp up to 85°C. Ideal for industrial applications, it features a CMOS technology, programmable SoC type, and surface mount capability.
5CSEBA6U23I7N
MCIMX6S7CVM08AD
MCIMX6S7CVM08AD by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -40 to 105 °C. It is used in industrial applications and has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.
MKW41Z512VHT4
The NXP Semiconductors MKW41Z512VHT4 is a CMOS microprocessor circuit with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.71 to 3.6 V. Ideal for industrial applications requiring high-performance uPs and uCs in surface-mount configurations.
SCANSTA112SMX
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;
CY8C624ABZI-S2D44
PROGRAMMABLE SoC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;
VS3674PITTA
Texas Instruments
VS3674PITTA by Texas Instruments is a MICROPROCESSOR CIRCUIT with 338 terminals in a GRID ARRAY package. It operates b/w 0-85 °C with supply voltage range of 1.28-1.42 V, making it ideal for low profile applications requiring fine pitch technology.
XC7Z007S-2CLG225E
The Xilinx XC7Z007S-2CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile and fine pitch grid array packages.
CMX7341Q3
Cml Microcircuits
CMX7341Q3 by Cml Microcircuits is a 48-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for industrial applications, it comes in a square chip carrier package style suitable for surface mount assembly.
1431
Nihon Dempa Kogyo
MSP430F6779IPZ
MSP430F6779IPZ by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. Operating at up to 25 MHz, it has ADC channels, I2C/SPI/UART compatibility, and operates in industrial temperatures. Ideal for applications requiring low power consumption and high performance in compact designs.
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LS1021AXN7KQB
LS1021AXN7KQB by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 525 terminals in a GRID ARRAY package. It operates b/w 0.97V to 1.03V, featuring CMOS technology and a peak reflow temperature of 260°C. Ideal for applications requiring high performance and compact design.
Freescale Semiconductor
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
LS1021ASN7KQB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;
LS1021AXE7KQB
LS1021AXE7KQB by NXP Semiconductors is a microprocessor circuit with a package style of grid array and heat sink/slug. It has a max supply voltage of 1.03V and a min supply voltage of 0.97V. This IC is commonly used in applications requiring high-performance processing capabilities.
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
LS1046AXE8Q1A
SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
LS1021ASE7HNB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 2.07 mm;
LS1043AXE8QQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;
LS1043AXE7MQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel; Terminal Finish: TIN SILVER COPPER;
LS1023ASN7KQB
MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;
LS1023AXE7MQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER; Maximum Operating Temperature: 105 Cel;
LS1023AXE7PQB
SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;
LS1021AXE7HNB
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
LS1023AXE7QQB
SoC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Width: 21 mm;
LS1018A
SYSTEM ON CHIP;
LS1021ASE7KQB
LS1023AXE8PQB
LS1017A
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
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