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MCIMX6S7CVM08AD

NXP Semiconductors

MCIMX6S7CVM08AD by NXP Semiconductors

MCIMX6S7CVM08AD by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -40 to 105 °C. It is used in industrial applications and has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

Median Price

$42.670

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 268 parts In-Stock

1+ parts

$42.100

100+ parts

$28.800

1k+ parts

$24.900

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268

$42.100

$28.800

$24.900

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Arrow

USA . 150 parts In-Stock

1+ parts

$42.670

100+ parts

$30.490

1k+ parts

$29.490

10k+ parts

-

150

$42.670

$30.490

$29.490

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Verical

USA . 150 parts In-Stock

1+ parts

$42.670

100+ parts

$30.490

1k+ parts

$29.490

10k+ parts

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150

$42.670

$30.490

$29.490

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Mouser Electronics

USA . 88 parts In-Stock

1+ parts

$57.600

100+ parts

$41.490

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88

$57.600

$41.490

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Flip Electronics (Authorized)

USA . 263 parts In-Stock

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263

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Avnet

USA . 120 parts In-Stock

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120

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$35.691

100+ parts

-

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50

$35.691

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Digiode

USA . 2,433 parts In-Stock

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$38.380

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2,433

$38.380

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Vyrian

USA . 2,461 parts In-Stock

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2,461

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Anansix

USA . 1,879 parts In-Stock

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1,879

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Flip Electronics

USA . 440 parts In-Stock

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440

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Cyclops Electronics Ltd

UK . 107 parts In-Stock

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Kiltronic GmbH

Germany . 40 parts In-Stock

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40

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Elcom Components

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,258 parts In-Stock

1+ parts

$19.750

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3,258

$19.750

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Semicontronic

India . 229 parts In-Stock

1+ parts

$32.300

100+ parts

$31.492

1k+ parts

$31.331

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229

$32.300

$31.492

$31.331

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Ampacity Inc.

Singapore . 22 parts In-Stock

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$32.300

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22

$32.300

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Continental Prestige Electronics

USA . 1,884 parts In-Stock

1+ parts

$35.691

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$34.977

1,884

$35.691

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$34.977

Corphita

USA . 586 parts In-Stock

1+ parts

$36.360

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586

$36.360

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Modulus Dynamics

Lithuania . 2,284 parts In-Stock

1+ parts

$36.600

100+ parts

$36.600

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$36.600

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2,284

$36.600

$36.600

$36.600

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Corohmni

South Africa . 1,027 parts In-Stock

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$36.600

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1,027

$36.600

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$37.698

100+ parts

$35.813

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$35.813

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500

$37.698

$35.813

$35.813

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Microchip USA

USA . 2,862 parts In-Stock

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$76.988

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2,862

$76.988

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Lixinc

USA . 19,536 parts In-Stock

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Argo Parts USA

USA . 4,892 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 1,971 parts In-Stock

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Perfect Parts

USA . 605 parts In-Stock

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605

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the MCIMX6S7CVM08AD by NXP Semiconductors, a high-quality Other Function uPs,uCs & Peripheral IC that revolutionizes the industry. With NXP's renowned reputation for excellence in manufacturing, this product offers unmatched reliability and performance. Its wide range of applications makes it an essential component for various industries. Experience the value it brings to your projects through its advanced features and benefits. Don't miss out on this opportunity to elevate your designs to new heights with the MCIMX6S7CVM08AD.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards.

Maximum Supply Voltage: 1.5 V

The high maximum supply voltage allows for flexibility in power input options.

Package Shape: SQUARE

The square shape of the package makes it easy to handle and integrate into designs.

No. of Terminals: 624

The high number of terminals provides a wide range of connectivity options for various applications.

Minimum Supply Voltage: 1.275 V

The low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper finishes provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

The terminal position at the bottom makes it easy for soldering and connection to the PCB.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for compact and space-saving designs.

Width: 21 mm

The moderate width makes the product compatible with standard PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 40

The short time required at peak reflow temperature ensures efficient and quick assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and bonding during assembly.

Length: 21 mm

The moderate length makes the product suitable for various form factors and layout configurations.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliability and performance in harsh environments.

Peripheral IC Type: SYSTEM ON CHIP

The system-on-chip design integrates multiple functions into a single IC, reducing complexity and improving efficiency.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides secure connections and reliable contact with the PCB.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting and compact PCB designs.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level ensures proper handling and storage to prevent damage during assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6S7CVM08AD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6S7CVM08AD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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