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MCIMX6Y2DVM09AB

NXP Semiconductors

MCIMX6Y2DVM09AB by NXP Semiconductors

MCIMX6Y2DVM09AB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.25-1.3 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.

Median Price

$10.649

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 145 parts In-Stock

1+ parts

$8.439

100+ parts

-

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-

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145

$8.439

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Chip1Stop

Japan . 730 parts In-Stock

1+ parts

$10.100

100+ parts

$8.500

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-

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730

$10.100

$8.500

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Arrow

USA . 145 parts In-Stock

1+ parts

$10.348

100+ parts

$8.627

1k+ parts

$8.439

10k+ parts

-

145

$10.348

$8.627

$8.439

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DigiKey

USA . 759 parts In-Stock

1+ parts

$15.560

100+ parts

$11.486

1k+ parts

$9.842

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759

$15.560

$11.486

$9.842

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Mouser Electronics

USA . 325 parts In-Stock

1+ parts

$15.560

100+ parts

$10.390

1k+ parts

$9.590

10k+ parts

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325

$15.560

$10.390

$9.590

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EBV Elektronik

Germany . 21,128 parts In-Stock

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21,128

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Newark

USA . 1,949 parts In-Stock

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$10.950

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$9.250

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1,949

-

$10.950

$9.250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$12.120

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-

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900

$12.120

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Digiode

USA . 1,210 parts In-Stock

1+ parts

$12.920

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1,210

$12.920

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Chip Stock

USA . 19,262 parts In-Stock

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19,262

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IBS Electronics

USA . 4,104 parts In-Stock

1+ parts

-

100+ parts

$11.388

1k+ parts

$11.879

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4,104

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$11.388

$11.879

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Flip Electronics

USA . 3,040 parts In-Stock

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3,040

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Linux4Media Gmbh

Germany . 2,940 parts In-Stock

1+ parts

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100+ parts

$7.015

1k+ parts

$6.710

10k+ parts

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2,940

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$7.015

$6.710

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TME

Poland . 2,128 parts In-Stock

1+ parts

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$12.604

10k+ parts

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2,128

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$12.604

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NAC Semi

USA . 608 parts In-Stock

1+ parts

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$12.920

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608

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$12.920

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Vyrian

USA . 414 parts In-Stock

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414

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Anansix

USA . 348 parts In-Stock

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348

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Bristol Electronics

USA . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 384 parts In-Stock

1+ parts

$11.050

100+ parts

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384

$11.050

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Semicontronic

India . 365 parts In-Stock

1+ parts

$11.050

100+ parts

$10.774

1k+ parts

$10.718

10k+ parts

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365

$11.050

$10.774

$10.718

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$11.878

100+ parts

-

1k+ parts

$11.402

10k+ parts

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1,000

$11.878

-

$11.402

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Continental Prestige Electronics

USA . 605 parts In-Stock

1+ parts

$12.120

100+ parts

-

1k+ parts

-

10k+ parts

$11.878

605

$12.120

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-

$11.878

Corphita

USA . 2,203 parts In-Stock

1+ parts

$12.240

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2,203

$12.240

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$25.720

100+ parts

$24.434

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$24.434

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500

$25.720

$24.434

$24.434

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Microchip USA

USA . 1,730 parts In-Stock

1+ parts

$48.270

100+ parts

$47.580

1k+ parts

$47.240

10k+ parts

$46.890

1,730

$48.270

$47.580

$47.240

$46.890

Corohmni

South Africa . 2,197 parts In-Stock

1+ parts

$66.132

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2,197

$66.132

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Modulus Dynamics

Lithuania . 3,579 parts In-Stock

1+ parts

$66.175

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$66.175

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$66.175

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3,579

$66.175

$66.175

$66.175

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Aztec Data Supply Inc.

USA . 257 parts In-Stock

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$80.060

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257

$80.060

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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iodParts Technologies Inc.

India . 6,303 parts In-Stock

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6,303

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A-Z Elektronik GmbH

Germany . 5,943 parts In-Stock

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5,943

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UNI Independent Distributors

Spain . 5,137 parts In-Stock

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Lixinc

USA . 4,170 parts In-Stock

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4,170

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Robosynatics

Brazil . 3,768 parts In-Stock

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3,768

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Lucentia Tech

USA . 3,768 parts In-Stock

1+ parts

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100+ parts

$35.681

1k+ parts

$34.953

10k+ parts

$34.953

3,768

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$35.681

$34.953

$34.953

Futuretech Components

Singapore . 2,200 parts In-Stock

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Perfect Parts

USA . 681 parts In-Stock

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681

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Argo Parts USA

USA . 150 parts In-Stock

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150

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Overview

Discover the cutting-edge MCIMX6Y2DVM09AB by NXP Semiconductors, a top-tier manufacturer renowned for superior quality and reliability. This versatile system on chip offers endless possibilities in various applications within the category of Other Function uPs,uCs & Peripheral ICs. With a low profile, fine pitch package design and advanced CMOS technology, this product provides unmatched performance and efficiency. Experience the value and benefits of seamless integration, high-speed processing, and optimal functionality tailored to meet your specific needs. Elevate your projects with the MCIMX6Y2DVM09AB and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.3 V

The high maximum supply voltage of 1.3 V provides flexibility and compatibility with various power sources.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization and allows for easy placement within electronic devices.

No. of Terminals: 289

Having a large number of terminals enables connectivity to a wide range of external components, making the product versatile in applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration and increased reliability in operation.

Minimum Supply Voltage: 1.25 V

With a low minimum supply voltage of 1.25 V, the product can operate efficiently even with limited power sources.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95°C ensures stability and performance under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C guarantees functionality in a wide range of temperature settings.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates secure and stable connections with external components.

Maximum Seated Height: 1.32 mm

The low maximum seated height allows for a slim profile design, ideal for compact electronic devices.

Width: 14 mm

The moderate width of 14 mm provides a balanced form factor for easy integration into various electronic layouts.

Maximum Time At Peak Reflow Temperature: 40 s

The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and bonding during assembly processes.

Peak Reflow Temperature: 260°C

The peak reflow temperature of 260°C enables stable and reliable solder joints for secure connections.

Length: 14 mm

The length of 14 mm complements the width, offering a compact and space-efficient form factor.

Peripheral IC Type: SYSTEM ON CHIP

The system on chip peripheral IC type integrates multiple functions into a single chip, reducing component count and enhancing efficiency.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, resulting in efficient and reliable operation.

Terminal Form: BALL

The ball terminal form offers secure and reliable connections, ensuring stable communication between the product and external devices.

Nominal Supply Voltage: 1.275 V

The nominal supply voltage of 1.275 V ensures consistent and stable power delivery for optimal performance.

Terminal Pitch: 0.8 mm

The tight terminal pitch of 0.8 mm allows for high-density mounting and compact layout designs, saving valuable space.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to maintain product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Y2DVM09AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.32 mm

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX6Y2DVM09AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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