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MCIMX356AJQ5C

NXP Semiconductors

MCIMX356AJQ5C by NXP Semiconductors

MCIMX356AJQ5C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.33V to 1.47V, making it ideal for industrial applications requiring low profile, fine pitch ICs in a grid array package style.

Median Price

$26.201

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,170 parts In-Stock

1+ parts

$14.680

100+ parts

$14.390

1k+ parts

$14.090

10k+ parts

-

1,170

$14.680

$14.390

$14.090

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Mouser Electronics

USA . 429 parts In-Stock

1+ parts

$30.390

100+ parts

$28.130

1k+ parts

$26.140

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429

$30.390

$28.130

$26.140

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Verical

USA . 9,900 parts In-Stock

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$26.201

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9,900

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$26.201

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EBV Elektronik

Germany . 9,720 parts In-Stock

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9,720

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Avnet

USA . 180 parts In-Stock

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180

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Distributors (In-Stock)

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Digiode

USA . 633 parts In-Stock

1+ parts

$13.946

100+ parts

-

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633

$13.946

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Nova Conductors

Japan . 77 parts In-Stock

1+ parts

$27.610

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77

$27.610

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Chip Stock

USA . 3,103 parts In-Stock

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Anansix

USA . 2,010 parts In-Stock

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Vyrian

USA . 231 parts In-Stock

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231

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TME

Poland . 210 parts In-Stock

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$36.890

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210

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$36.890

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Distributors (Availability)

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Ampacity Inc.

Singapore . 530 parts In-Stock

1+ parts

$12.480

100+ parts

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530

$12.480

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$12.521

100+ parts

$11.394

1k+ parts

$10.267

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450

$12.521

$11.394

$10.267

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Corphita

USA . 3,438 parts In-Stock

1+ parts

$13.212

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3,438

$13.212

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Component Stockers USA

USA . 7,024 parts In-Stock

1+ parts

$18.800

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7,024

$18.800

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Aztec Data Supply Inc.

USA . 3,450 parts In-Stock

1+ parts

$21.929

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3,450

$21.929

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Semicontronic

India . 477 parts In-Stock

1+ parts

$27.160

100+ parts

$26.481

1k+ parts

$26.345

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477

$27.160

$26.481

$26.345

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Continental Prestige Electronics

USA . 3,438 parts In-Stock

1+ parts

$27.610

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$27.058

3,438

$27.610

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$27.058

Netroflash

USA . 500 parts In-Stock

1+ parts

$27.610

100+ parts

-

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$26.230

10k+ parts

$25.677

500

$27.610

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$26.230

$25.677

Microchip USA

USA . 1,518 parts In-Stock

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$60.401

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1,518

$60.401

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Corohmni

South Africa . 4,936 parts In-Stock

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$61.612

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4,936

$61.612

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iBuyXS LLC

. 300 parts In-Stock

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$161.000

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$161.000

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A-Z Elektronik GmbH

Germany . 5,097 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,292 parts In-Stock

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Argo Parts USA

USA . 4,128 parts In-Stock

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Lixinc

USA . 2,304 parts In-Stock

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Perfect Parts

USA . 202 parts In-Stock

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Overview

Unlock the potential of your next project with the MCIMX356AJQ5C by NXP Semiconductors. This innovative System on Chip offers unparalleled quality and reliability, backed by NXP's reputation as a leader in semiconductor technology. Ideal for a variety of applications, this product provides value through its high performance and efficiency. Experience the benefits of cutting-edge technology and seamless integration, all in a compact and versatile package. Elevate your designs with the MCIMX356AJQ5C and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product ideal for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing overall production costs.

Maximum Supply Voltage: 1.47 V

With a high maximum supply voltage, the product can handle a wide range of input voltages, increasing its versatility.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive industry standards for reliability and performance.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and easy alignment during assembly.

No. of Terminals: 400

Having a high number of terminals enables the product to connect to multiple components and peripherals, increasing its functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with a low profile and fine pitch, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.33 V

The low minimum supply voltage requirement allows the product to operate efficiently even with low-power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperature conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The product can operate in extreme cold temperatures, ensuring reliability in various environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and assembly of the product onto the PCB.

Maximum Seated Height: 1.6 mm

The low seated height of the product saves space on the PCB and allows for more compact device designs.

Width: 17 mm

The compact width of the product enables it to fit into tight spaces and densely populated PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 40

The product can withstand peak reflow temperatures for a sufficient duration during assembly, ensuring proper soldering.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can endure the soldering process without damage.

Length: 17 mm

The compact length of the product allows for a space-saving design and easier integration into electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in harsh industrial environments.

Peripheral IC Type: SYSTEM ON CHIP

The integration of multiple peripheral functions into a single system-on-chip design simplifies circuitry, reducing complexity and cost.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form allows for reliable connections and facilitates easy rework during PCB assembly.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage compatibility with standard voltage levels ensures seamless integration into existing systems.

Terminal Pitch: 0.8 mm

The fine terminal pitch enables high-density mounting on the PCB, saving space and improving overall system performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand multiple soldering cycles without degradation due to moisture exposure.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX356AJQ5C attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.33 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCIMX356AJQ5C Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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