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MCIMX6Q7CVT08AE

NXP Semiconductors

MCIMX6Q7CVT08AE by NXP Semiconductors

MCIMX6Q7CVT08AE by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for industrial applications requiring fine pitch grid array package style.

Median Price

$115.055

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 60 parts In-Stock

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$97.200

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$76.500

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60

$97.200

$76.500

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Arrow

USA . 63 parts In-Stock

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$113.040

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$88.770

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$87.880

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63

$113.040

$88.770

$87.880

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Mouser Electronics

USA . 10 parts In-Stock

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$117.070

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$90.900

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10

$117.070

$90.900

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DigiKey

USA . 218 parts In-Stock

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$117.970

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$90.899

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$90.899

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Newark

USA . 67 parts In-Stock

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$119.080

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$94.510

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$91.750

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67

$119.080

$94.510

$91.750

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Element14

Singapore . 67 parts In-Stock

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$170.440

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$138.370

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67

$170.440

$138.370

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EBV Elektronik

Germany . 42,300 parts In-Stock

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Verical

USA . 5,220 parts In-Stock

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$89.591

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$88.691

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$88.691

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Avnet

USA . 660 parts In-Stock

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Rochester

USA . 2 parts In-Stock

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$76.470

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$68.420

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$64.390

2

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$76.470

$68.420

$64.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,824 parts In-Stock

1+ parts

$67.260

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$67.260

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Nova Conductors

Japan . 50 parts In-Stock

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$106.800

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$106.800

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TME

Poland . 5,270 parts In-Stock

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$110.390

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5,270

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$110.390

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Chip Stock

USA . 4,200 parts In-Stock

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Anansix

USA . 726 parts In-Stock

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Cyclops Electronics Ltd

UK . 719 parts In-Stock

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Vyrian

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Bristol Electronics

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Ampacity Inc.

Singapore . 30 parts In-Stock

1+ parts

$60.180

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30

$60.180

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Corphita

USA . 3,969 parts In-Stock

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$63.720

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3,969

$63.720

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Aztec Data Supply Inc.

USA . 3,677 parts In-Stock

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$77.020

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$77.020

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Corohmni

South Africa . 22 parts In-Stock

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$86.180

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$86.180

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Continental Prestige Electronics

USA . 64 parts In-Stock

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$90.760

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$99.968

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$91.971

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$86.179

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$99.968

$91.971

$86.179

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Bastille Electronics

Australia . 450 parts In-Stock

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$106.800

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$101.460

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$95.052

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$106.800

$101.460

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$95.052

Microchip USA

USA . 1,544 parts In-Stock

1+ parts

$112.140

100+ parts

$109.150

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$107.650

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$106.160

1,544

$112.140

$109.150

$107.650

$106.160

Semicontronic

India . 162 parts In-Stock

1+ parts

$130.980

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$127.706

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$127.051

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$130.980

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$127.051

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Argo Parts USA

USA . 2,106 parts In-Stock

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UNI Independent Distributors

Spain . 1,837 parts In-Stock

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Perfect Parts

USA . 879 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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Modulus Dynamics

Lithuania . 22 parts In-Stock

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Overview

Elevate your electronic designs with the MCIMX6Q7CVT08AE from NXP Semiconductors. This cutting-edge SoC peripheral IC boasts top-tier quality and reliability, making it the perfect choice for a wide range of applications. With a focus on innovation and performance, NXP Semiconductors has crafted a product that delivers unparalleled value to customers. Experience the benefits of this versatile device and unlock endless possibilities in your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring reliable performance in various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly on PCBs, saving time and reducing production costs.

Maximum Supply Voltage: 1.5 V

The high maximum supply voltage capability provides flexibility in power sourcing options to meet different operating requirements.

Package Shape: SQUARE

The square package shape simplifies PCB layout and offers uniformity in design aesthetics.

No. of Terminals: 624

Having a high number of terminals enables connectivity to multiple components, allowing for complex circuit configurations.

Package Style: GRID ARRAY, FINE PITCH

The grid array, fine pitch package style provides high interconnect density for enhanced functionality and performance.

Minimum Supply Voltage: 1.275 V

The low minimum supply voltage requirement allows for efficient operation in low-power applications, saving energy.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature capability ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range of operation enables the product to function effectively in both hot and cold environments.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent conductivity, ensuring optimal signal transmission.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy connection to the PCB, simplifying the assembly process.

Maximum Seated Height: 2.16 mm

The low maximum seated height saves space on the PCB, allowing for a more compact and efficient design.

Width: 21 mm

The 21mm width provides compatibility with standard PCB sizes, making integration into existing systems easier.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for robust soldering connections, ensuring long-term durability.

Length: 21 mm

The 21mm length offers a compact form factor, making the product suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates ruggedness and reliability for use in harsh industrial environments.

Peripheral IC Type: SoC

The System on Chip (SoC) peripheral IC type integrates multiple functions into a single chip, reducing system complexity and cost.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides reliable contact and connection with the PCB, ensuring stable performance over time.

Nominal Supply Voltage: 1.4 V

The 1.4V nominal supply voltage offers a balanced operating voltage to meet performance and power efficiency requirements.

Terminal Pitch: 0.8 mm

The small 0.8mm terminal pitch allows for high-density packaging and efficient use of PCB real estate.

Moisture Sensitivity Level (MSL): 3

The MSL-3 rating indicates moderate sensitivity to moisture, requiring standard handling and storage precautions to maintain product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Q7CVT08AE attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA624,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6Q7CVT08AE Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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