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XTDA4VHXXXGAALY

Texas Instruments

XTDA4VHXXXGAALY by Texas Instruments

XTDA4VHXXXGAALY by Texas Instruments is a 1414-terminal SoC IC with CMOS technology. It operates b/w 0-70°C, with supply voltage ranging from 0.76-0.84 V. This square-shaped IC in grid array package is ideal for applications requiring fine pitch and heat dissipation.

Median Price

$150.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$150.000

100+ parts

-

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10

$150.000

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Digiode

USA . 3,390 parts In-Stock

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3,390

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Vyrian

USA . 2,947 parts In-Stock

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2,947

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 633 parts In-Stock

1+ parts

$14.625

100+ parts

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633

$14.625

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Semicontronic

India . 1,216 parts In-Stock

1+ parts

$21.000

100+ parts

$20.475

1k+ parts

$20.370

10k+ parts

-

1,216

$21.000

$20.475

$20.370

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One Stop Electronics

USA . 1,416 parts In-Stock

1+ parts

$28.000

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1,416

$28.000

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Ampacity Inc.

Singapore . 770 parts In-Stock

1+ parts

$32.000

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770

$32.000

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Continental Prestige Electronics

USA . 1,753 parts In-Stock

1+ parts

$150.000

100+ parts

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10k+ parts

$147.000

1,753

$150.000

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$147.000

Netroflash

USA . 500 parts In-Stock

1+ parts

$150.000

100+ parts

-

1k+ parts

$142.500

10k+ parts

$139.500

500

$150.000

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$142.500

$139.500

Corphita

USA . 2,681 parts In-Stock

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2,681

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Argo Parts USA

USA . 1,631 parts In-Stock

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1,631

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Overview

Unleash the power of innovation with the XTDA4VHXXXGAALY by Texas Instruments. This cutting-edge product boasts top-notch quality and reliability from a trusted manufacturer like Texas Instruments. Ideal for a wide range of applications in the category of Other Function uPs, uCs & Peripheral ICs, this product offers unparalleled value and benefits to customers. Experience seamless performance, high efficiency, and unmatched versatility with the XTDA4VHXXXGAALY. Elevate your projects to new heights with this exceptional offering from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making it a reliable choice.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort.

Maximum Supply Voltage: 0.84 V

With a high maximum supply voltage, this product can handle higher power requirements without risk of damage.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board, maximizing functionality in a compact design.

No. of Terminals: 1414

The large number of terminals allows for a wide range of connections, making this product versatile and adaptable to various applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

This package style offers enhanced thermal management and precise alignment, ensuring optimal performance.

Minimum Supply Voltage: 0.76 V

With a low minimum supply voltage, this product is energy-efficient and ideal for battery-powered devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance even in extreme conditions.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this product can operate effectively in cold environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process and allows for easy accessibility during maintenance.

Maximum Seated Height: 3.341 mm

The low seated height enables a slim profile, making this product suitable for compact designs.

Width: 31 mm

The moderate width provides a good balance between space-saving and ease of handling during installation.

Length: 31 mm

The compact length allows for flexibility in placement on a circuit board, optimizing layout options.

Peripheral IC Type: SoC

Being a System-on-Chip (SoC) peripheral IC offers integrated functionality and streamlined design for efficient performance.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making this product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides secure connections and simplifies the soldering process for enhanced reliability.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage offers a stable power input, ensuring consistent performance.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for precise connections, enhancing overall reliability and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XTDA4VHXXXGAALY attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1414

Length:

31 mm

No. of Terminals:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1414,38X38,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Maximum Seated Height:

3.341 mm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

31 mm

Peripheral IC Type:

SoC

Trade Compliance

XTDA4VHXXXGAALY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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