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XTDA4APXXXGAALY

Texas Instruments

XTDA4APXXXGAALY by Texas Instruments

XTDA4APXXXGAALY by Texas Instruments is a 1414-terminal SoC with CMOS technology. It operates b/w 0-70°C, with supply voltage ranging from 0.76-0.84V. This grid array IC is ideal for applications requiring low power consumption and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,099 parts In-Stock

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5,099

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Digiode

USA . 4,657 parts In-Stock

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4,657

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 741 parts In-Stock

1+ parts

$15.000

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741

$15.000

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AZTECH Wire

Italy . 209 parts In-Stock

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$16.177

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209

$16.177

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One Stop Electronics

USA . 854 parts In-Stock

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$23.000

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854

$23.000

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Corphita

USA . 1,132 parts In-Stock

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1,132

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the XTDA4APXXXGAALY by Texas Instruments. This innovative product offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Perfect for a wide range of applications in the category of Other Function uPs, uCs & Peripheral ICs, this product delivers exceptional value and benefits to customers. Experience seamless performance and unmatched convenience with the XTDA4APXXXGAALY - the ultimate solution for all your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and reliable, ensuring the product will last long and withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for efficient and cost-effective assembly of the product onto circuit boards, saving time during the manufacturing process.

Maximum Supply Voltage: 0.84 V

The high maximum supply voltage ensures stable operation and performance under varying voltage conditions.

Package Shape: SQUARE

The square package shape helps in easy placement and alignment of the product on the circuit board, making it user-friendly for assembly.

No. of Terminals: 1414

The large number of terminals allows for the connection of multiple components, increasing the functionality and versatility of the product.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

The package style with grid array, heat sink/slug, and fine pitch design enhances thermal management and electrical connectivity, maintaining optimal performance.

Minimum Supply Voltage: 0.76 V

The low minimum supply voltage ensures efficiency and reliable operation even under low voltage conditions, enhancing the product's versatility.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can function effectively in a wide range of temperature environments, increasing its usability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures the product can perform reliably even in cold temperature conditions, making it suitable for various applications.

Terminal Position: BOTTOM

The terminal position at the bottom of the package allows for easy and secure connection to the circuit board, ensuring proper functionality and stability.

Maximum Seated Height: 3.341 mm

The low maximum seated height of the product enables space-saving and compact design, ideal for applications where size constraints are a concern.

Width: 31 mm

The moderate width of the product makes it easy to integrate into various circuit board layouts, providing flexibility in design and placement.

Length: 31 mm

The matching length with the width ensures a balanced and compact form factor, facilitating efficient installation and space utilization in electronic assemblies.

Peripheral IC Type: SoC

The System on a Chip (SoC) peripheral IC type offers integrated functionality, reducing the need for additional components and simplifying the design and assembly process.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring energy efficiency and reliable operation of the product.

Terminal Form: BALL

The ball terminal form allows for reliable and secure connections, reducing the risk of disconnection and ensuring stable performance of the product.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage of 0.8V ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm enables high-density mounting and efficient use of space on the circuit board, increasing design flexibility and functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XTDA4APXXXGAALY attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1414

Length:

31 mm

No. of Terminals:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1414,38X38,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Maximum Seated Height:

3.341 mm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

31 mm

Peripheral IC Type:

SoC

Trade Compliance

XTDA4APXXXGAALY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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