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XTDA4VPXXXGAALY

Texas Instruments

XTDA4VPXXXGAALY by Texas Instruments

XTDA4VPXXXGAALY by Texas Instruments is a 1414-terminal SoC with CMOS technology. It operates b/w 0-70°C, with supply voltage ranging from 0.76-0.84 V. This package is ideal for applications requiring fine pitch grid array ICs in a square shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,151 parts In-Stock

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Digiode

USA . 793 parts In-Stock

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Nova Conductors

Japan . 86 parts In-Stock

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86

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 337 parts In-Stock

1+ parts

$13.510

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337

$13.510

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One Stop Electronics

USA . 544 parts In-Stock

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$20.000

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544

$20.000

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Ampacity Inc.

Singapore . 1,397 parts In-Stock

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$32.000

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$32.000

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 1,188 parts In-Stock

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Overview

Upgrade your electronics with the XTDA4VPXXXGAALY by Texas Instruments, a top-quality product designed to meet your specific needs. Manufactured by industry leader Texas Instruments, this cutting-edge device is perfect for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. With a focus on innovation and reliability, this product offers unparalleled value, benefits, and advantages to customers looking to enhance their technology experience. Experience superior performance and functionality with the XTDA4VPXXXGAALY, the ultimate choice for your electronic projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material is durable and cost-effective, making the product a reliable choice.

Surface Mount

YES - Allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage

0.84 V - Provides a wide operating range for flexibility in various applications.

Package Shape

SQUARE - Provides a compact and efficient design for optimized board space usage.

No. of Terminals

1414 - Offers ample connectivity options for versatile integration with other components.

Package Style

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH - Enables efficient heat dissipation and precise mounting for improved performance.

Minimum Supply Voltage

0.76 V - Ensures stable operation even in low-power environments.

Maximum Operating Temperature

70 °C - Withstands high temperatures for reliable performance in demanding conditions.

Minimum Operating Temperature

0 °C - Can operate in a wide range of temperatures for versatility in different environments.

Terminal Position

BOTTOM - Facilitates easy connections and installation on PCBs.

Maximum Seated Height

3.341 mm - Low-profile design for space-saving in compact devices.

Width

31 mm - Compact form factor for efficient use of board space.

Length

31 mm - Provides a balanced shape for easy integration into various designs.

Peripheral IC Type

SoC - Combines multiple functions into a single chip for simplified circuitry and reduced costs.

Technology

CMOS - Offers low power consumption and high noise immunity for efficient operation.

Terminal Form

BALL - Ensures secure and reliable connections with other components.

Nominal Supply Voltage

0.8 V - Standard voltage level for compatibility with various systems.

Terminal Pitch

0.8 mm - Allows for precise placement on PCBs for optimal connectivity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XTDA4VPXXXGAALY attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B1414

Length:

31 mm

No. of Terminals:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1414,38X38,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Maximum Seated Height:

3.341 mm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

31 mm

Peripheral IC Type:

SoC

Trade Compliance

XTDA4VPXXXGAALY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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