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XC7Z045-2FBG676E

Xilinx

XC7Z045-2FBG676E by Xilinx

XC7Z045-2FBG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

Median Price

$2,040.530

Lifecycle Status

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6

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1k+

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Farnell

UK . 1 parts In-Stock

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$1,971.440

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Mouser Electronics

USA . 3 parts In-Stock

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Digiode

USA . 326 parts In-Stock

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$1,856.528

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VNN

France . 733 parts In-Stock

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Nova Conductors

Japan . 60 parts In-Stock

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$1,973.905

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Vyrian

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AZTECH Wire

Italy . 533 parts In-Stock

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$18.169

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Aztec Data Supply Inc.

USA . 174 parts In-Stock

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$23.780

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Corohmni

South Africa . 534 parts In-Stock

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$25.275

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Modulus Dynamics

Lithuania . 1,269 parts In-Stock

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$110.215

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Texas Native Microelectronics

USA . 791 parts In-Stock

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$123.816

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$118.863

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$115.149

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$108.958

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$108.958

Microchip USA

USA . 2,810 parts In-Stock

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$938.150

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$920.950

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$896.710

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$872.480

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Continental Prestige Electronics

USA . 1 parts In-Stock

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$1,520.000

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$1,661.100

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Semicontronic

India . 2 parts In-Stock

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$1,661.100

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$1,619.572

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$1,611.267

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Corphita

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Argo Parts USA

USA . 1,202 parts In-Stock

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$1,954.360

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$1,934.816

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$1,915.273

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$1,895.729

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Netroflash

USA . 2,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,027 parts In-Stock

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MARBEL Systems

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Supply Digital

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Kenton Components

USA . 450 parts In-Stock

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Vigor

Singapore . 392 parts In-Stock

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Kepictronics

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Futuretech Components

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Qasali Group International

UK . 10 parts In-Stock

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$320.931

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$294.187

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$294.187

Overview

Unlock the power of cutting-edge technology with the XC7Z045-2FBG676E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that redefine innovation. This versatile system on chip offers endless possibilities for applications in various industries. With its advanced features and reliable performance, this product provides unmatched value and benefits to customers looking to stay ahead of the curve. Upgrade your projects with the XC7Z045-2FBG676E and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product long-lasting and affordable.

Surface Mount: YES

Surface mounting allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 1.05 V

Allows for versatile power options and compatibility with various systems.

Package Shape: SQUARE

Square shape helps in efficient PCB layout and space utilization.

No. of Terminals: 676

High number of terminals allows for versatile connectivity options and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal performance and reliability.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage helps in energy efficiency and performance optimization.

Maximum Operating Temperature: 100 °C

High operating temperature range ensures reliability in various environments and applications.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for usage in extreme conditions without compromising performance.

Peripheral IC Type: SYSTEM ON CHIP

System-on-chip design integrates multiple functions into a single chip, reducing system complexity and cost.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage ensures consistent and reliable operation.

Terminal Form: BALL

Ball terminals provide secure connections and durability in various operating conditions.

Terminal Pitch: 1 mm

Fine terminal pitch allows for dense packing and smaller footprint on the PCB, saving space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XC7Z045-2FBG676E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

XC7Z045-2FBG676E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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